Sakuu Corporation

Justin Carroll

Morteza Vatani

Timothy Byman

Seyed Mohammad Sajadi

Brian Lindahl

David Paul Wanamaker

Don Ambli

Tom Hays

Tim Debruin

Lawrence Nguyen

Kevin Nesdahl

Peter Bruss

An improved apparatus and method provide conditioning to a powder deposited on a substrate (e.g., a web), for example, by wetting the powder in a 3D printing apparatus. To achieve this in an exemplary implementation, a wetting apparatus is located between a powder dispenser and at least one top calendering roller in a direction of movement of the substrate, wherein the wetting apparatus is configured to apply a wetting agent to the powder on the substrate before the powder passes through the calendering roller. The wetting agent is comprised of a material which increases cohesiveness of the powder to prevent the powder from adhering to the top roller. In a particular implementation, the wetting agent is steam confined to an area of the substrate where the powder passes through the wetting apparatus, without wetting other areas of the substrate which are not in the wetting apparatus.

Apparatus and method to provide conditioning to a deposited powder

An improved apparatus and method are provided to remove powder from a web, for example, in a 3D printing apparatus. A flexible blade is provided to contact and move across a first portion of the web located between adjacent portions of the web to scrape powder from the first portion without removing powder deposited on the adjacent portions. A pair of edge vacuum nozzles and a central vacuum nozzle are also provided to move with the flexible blade to remove powder from both edges of the first portion and a central region of the first portion.

Apparatus and method to remove powder with flexible scraper blade and adjustable side nozzles

Improved carrier plates and methods of use thereof are provided to secure and transport individual layers of a multilayer structure during manufacture of the multilayer structure. In one implementation a carrier plate is provided including a lower portion and a raised portion to support a flexible substrate holding an individual layer laid on an upper surface of the raised portion. Clamping mechanisms, such as rollers, are formed on extended regions adjacent to side walls of the raised portion. The clamping mechanisms are configured to move from open positions, where the clamping mechanisms are spaced apart from the sidewalls of the raised portion, to closed positions, where the clamping mechanisms secure opposite edge portions of the flexible substrate between the clamping mechanisms and the first and sidewalls of the raised portion.

Carrier plate and method of use thereof

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Vadnais Height, MN, United States of America

Justin Carroll