Other

Jurgen Schulz-Harder

Peter Maier

Altan Akyurek

Karsten Schmidt

The invention relates to a novel design of a cooler in the form of a heat pipe, with a housing in which an interior space closed to the outside is formed to hold a liquid, vaporizable coolant or heat-transport medium.

Cooler for electrical components

In a process for the manufacture of metal-ceramic compound material, especially metal-ceramic substrates, bonding compounds in the form of a plate-shaped ceramic substrate and an oxidized metal foil are bonded together by means of heating to a processing temperature in a protective gas atmosphere. For this purpose, the bonding components are placed in a reaction space formed within a capsule, which (space) is separated from the outer protective gas atmosphere by the capsule or in connection with the outer protective gas atmosphere only by means of a small opening.

PROCESS FOR THE MANUFACTURE OF METAL-CERAMIC COMPOUND MATERIAL IN PARTICULAR METAL-CERAMIC SUBSTRATES AND METAL-CERAMIC COMPOUND MATERIAL ESPECIALLY METAL-CERAMIC SUBSTRATE MANUFACTURED ACCORDING TO THIS PROCESS

The invention relates to a novel ceramic/metal substrate, especially to a multiple substrate with a ceramic plate or ceramic layer.

Ceramic/metal substrate, especially composite substrate

The invention pertains to a new type of process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process.

Process for the manufacture of substrates with textured metalizations and holding and fastening elements for use in this process

A cooler has a plurality of layers arranged in a stack and connected to one another along their surfaces. Each layer has openings allowing for three-dimensional flow of the coolant between an intake and an outlet. The flow resistance or the gradient of flow resistance increases from the intake to the outlet so that the coolant is increasingly forced to concentrate at the cooling surface as coolant flows from the intake to the outlet.

Cooler

The invention pertains to a new type of cooling system for cooling of heat sources, especially for cooling of electric components, with a cooler comprising, on a housing through which a coolant can flow, at least one first cooling surface that can be splashed with the coolant and at least one second cooling surface for flange-mounting of the heat source.

Cooling system

The invention relates to a novel process for producing a metal-ceramic substrate in which at least one surface side of the ceramic layer is provided with at least one first structured metal layer and at least one second metal layer is applied to the first by electroless chemical deposition, and in which at least one depression or hole, or a plurality of depressions or holes are formed in the ceramic layer by laser machining to form a scored line.

Process for producing a metal-ceramic substrate

A process is provided in which an initial substrate has a ceramic layer with metal layers on either side. At least one of the metal layers projects above one edge of the ceramic layer. The projecting sub-area is deformed so that the metal layer on the edge is disposed a distance from the surface of the ceramic layer, and along the edge in one border area with a stipulated width is separated from the ceramic layer.

An arched metal-ceramic substrate with one ceramic layer and with a metal coating provided on the top and bottom of the ceramic layer which is curved around at least one axis parallel to the plane of the substrate such that it forms a convexly curved surface on the bottom. The thickness of the metal coatings on the top and bottom of the arched ceramic layer is the same.

Metal ceramic substrate

A multiple substrate is provided having a large area individual base layer with multiple substrates, for electrical circuits formed thereon. Individual substrates are defined by score lines in the base layer, and include a fragment of the base layer and at least one metal coating is provided on at least one surface of the fragment and has areas which stabilize the multiple substrates against unwanted breaking. Several individual substrates are preformed along peripheral sides of the base layer, and at least one metal coating on each individual substrate projects over the peripheral side.

Multiple substrate

A process for producing a metal coated substrate with an improved resistivity to cyclic temperature stress is provided. The substrate is provided with at least one insulating layer and at least one metal layer attached to at least one side of the insulating layer. The metal layer is made at least 0.2 millimeters thick, and is weakened in places by openings formed in at least one border area.

Multiple substrate and process for its production

A metal coated substrate with improved resistivity to cyclic temperature stress is provided. A metal layers is attached to an insulating layer having a thickness of 0.2 mm. The metal layer is formed in a border area and is weakened by openings disposed in two rows. The depth of the openings nearer the border are greater than the depth of the openings in the tow farther from the border. The distance between the bottoms of the openings in the first row and the insulating layer is less than 1/3 of the thickness of the metal layer, and the distance between the bottom of the second row of openings and the surface of the insulating layer is 1/3 to 1/2 the thickness of the metal layer.

Metal coated substrate having improved resistivity to cyclic temperature

A metal coated substrate with improved resistivity to cyclic temperature stress is provided. A substrate has at least one insulating layer and at least metal layer attached to at least one side of the insulating layer. The metal layer is at least 0.2 millimeters thick, and is weakened in places by openings formed in at least one border area.

A process is provided where a ceramic metal substrate is produced by attaching metal foils on either side a ceramic layer to form metal layers and for producing a through connection by placing metal in an opening to form a bridge so that the metal layers are electrically connected together by direct bonding, and a metal body is inserted into the opening to almost fill it, while a surface of the metal body is provided with a layer with chemical compound of metal and reactive gas.

For the manufacture of a power semiconductor module, one proceeds from a ceramic base board on which copper plates and copper conductor paths are fastened by a suitable method. The ceramic base plate is then scratched and broken. As a result, ceramic side boards are produced which are connected to the base board via conductive paths. The side boards are then swung up, as a result of which the conductive paths fastened on the side boards come into a plane above the base plane. By means of suitable, possibly multiple, breaking and folding of the side boards and suitable development of the ends of the conductive paths, the connecting poles of the power semiconductor chips can be directly contacted. Electronic circuits can be arranged on the side boards.

Growing community of inventors

Lauf, Germany

Jurgen Schulz-Harder