Infineon Technologies Ag

Jurgen Preuninger

Gerhard Kunkel

Oliver Genz

An apparatus ( ) for patterning the surface of a semiconductor wafer ( ). A stage ( ) is coupled to a motor ( ) that is adapted to move the stage ( ) and a semiconductor wafer ( ) in a horizontal direction at a first speed A. A mask ( ) is disposed above the semiconductor wafer ( ), the mask ( ) being coupled to a motor ( ) that is adapted to move the mask ( ) in a horizontal direction at a second speed B. The ratio of the first and second speeds is different than the magnification factor, which may be other than 1:1 if a lens ( ) is used. The mask ( ) and the wafer ( ) may be moved in the same horizontal direction simultaneously during the exposure process at different speeds B and A, respectively, to provide a magnification or demagnification of the mask ( ) pattern onto the wafer ( ) surface.

Apparatus for patterning a semiconductor wafer

A method and apparatus ( ) for patterning the surface of a semiconductor wafer ( ). A stage ( ) is coupled to a motor ( ) that is adapted to move the stage ( ) and a semiconductor wafer ( ) in a horizontal direction at a first speed A. A mask ( ) is disposed above the semiconductor wafer ( ), the mask ( ) being coupled to a motor ( ) that is adapted to move the mask ( ) in a horizontal direction at a second speed B. The ratio of the first and second speeds is different than the magnification factor, which may be other than 1:1 if a lens ( ) is used. The mask ( ) and the wafer ( ) may be moved in the same horizontal direction simultaneously during the exposure process at different speeds B and A, respectively, to provide a magnification or demagnification of the mask ( ) pattern onto the wafer ( ) surface.

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Wappingers Falls, NY, United States of America

Jurgen Preuninger