Ev Group E. Thallner Gmbh

Jurgen Markus Suss

Thomas Wagenleitner

Thomas Plach

Florian Kurz

Dominik Zinner

Jurgen Mallinger

Christian Sinn

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

Apparatus and method for bonding substrates

A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.

Device and method for bonding of substrates

A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force Fand holding the second substrate to a second sample holder surface of a second sample holder with a holding force F; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature T; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature Tis reduced at the second sample holder surface during the bonding.

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.

Method and device for alignment of substrates

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.

Method for bonding substrates

A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.

Method and substrate holder for the controlled bonding of substrates

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.

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Rainbach, Austria

Jurgen Markus Suss