Morton International, Inc.

Hoechst Aktiengesellschaft

Jurgen Lingnau

Klaus Horn

Gerald Schutze

Karl-Friedrich Dossel

Klaus-Peter Martens

Werner Hinter

A coating-removing solution for photo-cross-linked and thermally cross-linked photoresist masks and solder resist masks cross-linked by exposure to light and heat and which solution contains a diglycol monoalkyl ether, a glycol monoalkyl ether, an alkali hydroxide, water, and a water-soluble fluoride.

Water soluble fluoride-containing solution for removing cured

Described is a process for the patterned metallisation of structured printed circuit boards in which the fully structured printed circuit board is covered with a solder stop mask, with the solder contact locations being left open, the solder stop mask is heated under such conditions that complete hardening does not yet occur and the copper surface of the printed circuit board is practically not oxidized, metal is deposited out of an aqueous bath at the exposed solder contact locations and after the metal deposit operation the mask is heated sufficiently long to a sufficiently high temperature that the mask is completely hardened throughout. The incomplete pre-hardening step prevents the solution infiltrating under the mask in the metallisation operation and thereby loosening the adhesion thereof.

Process for the patterned metallisation of structured printed circuit

Disclosed is an electrophotographic recording material comprising a photoconductive double layer disposed on an electrically conductive support, which double layer comprises a charge carrier-generating layer and a charge transport layer. The interface region of the charge carrier-generating and charge transport layers defines a mixing zone into which one or more of the constituents of the separate layers have diffused. A process for producing the electrophotographic recording material is also disclosed.

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Mainz, Germany

Jurgen Lingnau