Gebr. Schmid Gmbh

Jürgen Haungs

Christian Schmid

Dirk Habermann

Tom Stewart

Kenneth Provancha

Christian Buchner

Chuck Attema

Stefan Rapp

A method of producing a printed circuit board includes providing a base substrate that is a film or plate, has first and second substrate sides and consists partly of an electrically non-conducting organic polymer material, where the first substrate side is covered with a capping metal layer, and regionally removing the capping metal layer, wherein regionally removing the capping metal layer includes applying a mask layer to the capping metal layer, regionally removing the mask layer by a laser so that the first substrate side is divided into at least one first subregion, in which the first substrate side is covered only with the capping metal layer, and into at least one second subregion, in which the first substrate side is covered with the capping metal layer and by the mask layer, and removing the capping metal layer in the at least one first subregion by an etching solution.

Method of producing printed circuit boards

In an apparatus for producing thin layers on substrates for solar cell production, wherein the thin layers are applied by an APCVD process at temperatures of more than 250&#xb0; C., the substrates are conveyed on a horizontal conveyor path and coated by means of an APCVD coating in continuous operation. The conveyor path has conveyor rollers, which consist of a temperature-resistant, non-metallic material, preferably of ceramic. A heating device and/or a purge gas feeding device is/are arranged on that side of the conveyor path which is remote from the coating apparatus.

Apparatus and process for producing thin layers

Growing community of inventors

Freudenstadt, Germany

Jürgen Haungs