Siemens Aktiengesellschaft

Infineon Technologies Ag

Jurgen Fischer

Frank Puschner

Josef Mundigl

Josef Willer

Siegfried Birkle

Manfred Mengel

Peter Stampka

Johann Gehring

Detlef Houdeau

Manfred Fries

Herbert Palm

Michael Rogalli

Michael Huber

Josef Heitzer

Josef Kirschbauer

Gunter Didschies

Helmut Graf

Erich Hopf

An integrated circuit arrangement including a nonplanar substrate on which an integrated circuit is formed on at least one side, wherein the side of the substrate which has the integrated circuit is arranged on a carrier and the carrier is produced from a chemically resistant material.

Integrated circuit arrangement

Data carrier card having a card body of a flat form and having a recess, a carrier, a chip arranged on the carrier and inserted in the recess of the card body, external contact elements arranged on the carrier and electrically connected to the chip via conductor runs, and a cover covering the recess in operative connection with the carrier such that the carrier is held along the bottom in the recess, wherein the external contact elements and the chip are arranged on a same side of the carrier.

Data carrier card

A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

Method for producing a carrier element for semiconductor chips

A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.

Chip card

Carrier element for a semiconductor chip for integration into a

Device for electrolytic surface treatment of bulk material

Growing community of inventors

Deuerling, Germany

Jurgen Fischer