Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Wuhan China Star Optoelectronics Technology Co., Ltd.

Junyuan Wang

Hsianglun Hsu

Cunjun Xia

Jiajia Sun

Kan Wang

The present application provides an OLED display panel and an OLED display panel manufacturing method forming at least one crack-proof recess surrounding a display region on an array substrate. When the OLED display panel performs a laser cutting process to a cutting line region on the array substrate, cracks generated from the cutting line region is interrupted by the crack-proof recess and therefore cannot extend into a deep inside of a non-display region, and cannot further extend into the display region, which prevents a technical issue of a lowered yield rate due to extension of cracks into the display region.

OLED display panel and OLED display panel manufacturing method

A display panel, a manufacturing method thereof, and a display device are disclosed. For the display panel, an anti-crack structure is disposed in a chamfer between a driving circuit layer and a substrate. The anti-crack structure is in contact with a packaging layer to reduce an angle from the contact plane of the anti-crack structure and the packaging layer to the plane in which a light-emitting layer is located, so that the packaging layer is smoothly disposed, the risk of the fracture of the packaging layer is lowered, and the failure of the display panel is avoided.

Display panel including anti-crack structure within chamfered recess, manufacturing method thereof and display device

An organic light emitting diode display panel is provided and includes a display region and a through hole configured to receive an electronic element. The display region is disposed around a periphery of the through hole and includes a barrier structure and an encapsulation structure layer covering the barrier structure. The barrier structure is disposed on a side of a periphery of the through hole. The present invention, by extending the encapsulation structure layer from the display region to the barrier structure to cover the barrier structure, prevents water from invading an organic light emitting layer of the display region through the through hole.

Organic light emitting diode display panel

An organic light emitting diode (OLED) display panel and preparation method thereof, which includes an array substrate, an organic light emitting layer, and an encapsulation layer. The encapsulation layer includes organic-inorganic functional layer. Through disposing the organic-inorganic functional layer, the overall thickness of the encapsulation thin film can be reduced while ensuring the encapsulation effect, and the bending performance of the OLED device can be improved. Further, a mask plate is not required in the encapsulation process, thereby can effectively save production cost.

OLED display panel and preparation method thereof

The present invention provides an organic light-emitting diode (OLED) display panel, a manufacturing method of the OLED display panel, and a display device. The OLED display panel includes a substrate, an OLED light-emitting device, a first encapsulating layer, an electromagnetic interference (EMI) shielding cover, a second encapsulating layer, and a touch electrode. The OLED light-emitting device is arranged on the substrate. The first encapsulating layer covers the OLED light-emitting device. The EMI shielding cover encloses the first encapsulating layer and the OLED light-emitting device. The second encapsulating layer covers the EMI shielding cover. The touch electrode is arranged on the second encapsulating layer.

OLED display panel, manufacturing method thereof, and display device

An organic light emitting diode (OLED) display panel and a encapsulation method of the organic light emitting diode display panel are provided. The encapsulation method includes steps of providing an OLED display panel having an OLED light emitting element layer in a display area thereof and an organic peeling layer in a non-display area thereof; laminating an inorganic film layer prepared in a full-surface coating method and an organic film layer only covering the display area sequentially; and peeling off the organic peeling layer together with the inorganic film layer on the surface of the organic peeling layer, so as to form a thin film encapsulation layer.

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Wuhan, China

Junyuan Wang