Samsung Electronics Co., Ltd.

New Power Plasma Co., Ltd.

Junyoung Oh

Jongho Park

Yongkwan Lee

Seunghwan Kim

Sangsoo Kim

Hyunki Kim

Kyungsuk Oh

Jungjoo Kim

Hyunggil Baek

Seungkon Mok

Changyoung Yoo

Jongho Lee

Changkyu Choi

Daewook Kim

Jaeyeon Lee

Junga Lee

Seongho Han

Bookeun Oh

Boeun Jang

Sungun Wi

Kyonghwan Koh

Yongseok Seo

Seokyeon Hwang

Jaeho Kwak

Wonpil Lee

Yonghyun Kim

Gilho Kim

A semiconductor package is provided. The semiconductor package includes: a first package substrate; a first semiconductor chip on the first package substrate; an interposer substrate including a lower surface facing the first package substrate, an upper surface opposite to the lower surface, and an upper conductive pad in the upper surface of the interposer substrate; a first dam structure on the upper surface of the interposer substrate and extending along an edge of the upper conductive pad; a first molding layer in contact with the lower and upper surfaces of the interposer substrate and with an outer wall of the first dam structure; and a conductive connector in contact with an inner wall of the at least one first dam structure and with the upper conductive pad.

Interposer and semiconductor package including the same

An electronic device according to various embodiments of the present invention includes: a memory which stores one or more mapping parameters that indicate the correlation between a voltage change amount and the state of health (SOH) of the battery; and a processor, wherein the processor can be set to: detect that an external device for charging the battery is connected to the electronic device; charge the battery by using a charging current supplied from the external device; decide on at least one mapping parameter among the one or more mapping parameters on the basis of at least the charging current; check the voltage change amount of the battery while the battery is being charged; and acquire the SOH of the battery at least partially on the basis of the at least one mapping parameter and the voltage change amount.

Method for acquiring information about state of battery on basis of voltage change amount of battery during charging, and electronic device for supporting same

A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.

Interposers and semiconductor packages including the same

A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

Semiconductor package

A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.

Apparatus for conducting plasma surface treatment, board treatment system having the same

A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.

Methods of manufacturing semiconductor package and package-on-package

Growing community of inventors

Suwon-si, South Korea

Junyoung Oh