Xiamen Sanan Optoelectronics Technology Co., Ltd.

Other

Xiamen San'an Optoelectronics Co., Ltd

Hubei Sanan Optoelectronics Co., Ltd.

Junyong Kang

Jinjian Zheng

Chia-En Lee

Zhibai Zhong

Chen-Ke Hsu

Jiansen Zheng

Lixun Yang

Chen-ke Hsu

Zheng Wu

Feng Lin

Shuiqing Li

Ting Chen

Chang-Cheng Chuo

Feilin Xun

Mingyue Wu

Chilun Chou

Shutao Liao

Yaping Wu

Chunmiao Zhang

Huanrong Yang

Zhiming Wu

Zhijie Li

Na Gao

Heng Li

A semiconductor device includes a transfer substrate, an array of connecting structures, and an array of micro semiconductor elements. Each of the micro semiconductor elements has a semiconductor layered unit and at least one electrode. Each of the connecting structures interconnects a respective one of the micro semiconductor elements and the transfer substrate. In each of the micro semiconductor elements, the electrode is disposed on the semiconductor layered unit opposite to a respective one of the connecting structures. A width of at least a part of each of the connecting structures is smaller than a width of a connecting surface of the semiconductor layered unit of the respective one of the micro semiconductor elements. The connecting surface of the semiconductor layered unit of each of the micro semiconductor elements is connected to the respective one of the connecting structures.

Semiconductor device

A micro light-emitting device includes a support substrate, at least one micro light-emitting element, and a support structure. The support structure includes a bonding layer, an electrically conductive layer, and a protective insulation layer. The micro light-emitting element is supported by the support structure on the support substrate. The micro light-emitting element includes a light-emitting structure and first and second electrodes. First and second contact regions of the first electrode are respectively connected to a supporting post portion of the electrically conductive layer and a surrounding post portion of the protective insulation layer. A production method of the device and use of the element are also disclosed.

Micro light-emitting element and device, and use and production method thereof

A mass transfer method includes providing a transfer unit and a semiconductor carrying unit connected therewith, removing an element supporting structure of the semiconductor carrying unit from micro semiconductor elements of the semiconductor carrying unit, partially removing the photosensitive layer to form connecting structures, connecting a package substrate with electrodes of the micro semiconductor elements, breaking the connecting structures to separate the micro semiconductor elements from the transfer substrate. A mass transfer device is also disclosed.

Method and device for mass transfer of micro semiconductor elements

A mass transfer method includes forming a photosensitive layer on a transfer substrate, heating the photosensitive layer at a temperature for the same to be in a partially cured state, disposing micro semiconductor elements on the photosensitive layer in the partially cured state, partially removing the photosensitive layer to form connecting structures, providing a package substrate and metallic support members, subjecting the metallic support members and the micro semiconductor elements to a eutectic process, breaking the connecting structures to separate the micro semiconductor elements from the transfer substrate, and removing the remaining connecting structures from the micro semiconductor elements.

Method for mass transfer of micro semiconductor elements

A process for packaging at least one component includes the steps of: a) providing a substrate and a packaging material layer, b) forming the packaging material layer into an adhesively semi-cured packaging material layer, c) adhering the adhesively semi-cured packaging material layer to an array, d) providing a packaging unit including at least one eutectic metal bump pair, e) permitting the eutectic metal bump pair to be in contact with at least one electrode pair on the array, f) subjecting the electrode pair to eutectic bonding to the eutectic metal bump pair, g) encapsulating the component by pressing, h) completely curing the adhesively semi-cured packaging material layer, and i) removing the substrate.

Process for packaging component

A light emitting diode (LED) device includes a light emitting epitaxial layer having opposite first and second surfaces and a plurality of microlenses formed on the first surface. The light emitting epitaxial layer includes a first type semiconductor layer defining the first surface, a second type semiconductor layer defining the second surface, and a light emitting layer disposed between the first and second type semiconductor layers and spaced apart from the first and second surfaces. The microlenses are formed on the first surface and formed of a light transmissible substrate for epitaxial growth of the light emitting epitaxial layer. A method for manufacturing the light emitting diode device is also disclosed.

Light emitting diode device and method for manufacturing the same

The present invention discloses a molecular beam epitaxy under vector strong magnetic field and an in-situ characterization apparatus thereof. The apparatus mainly consists of an inverted T-shaped ultrahigh vacuum growth and characterization chamber with a compact structure and a strong magnet. The inverted T-shaped vacuum chamber portion, which disposed in the room-temperature chamber of the strong magnet, includes a compact epitaxial growth sample stage, a device capable of rotating angle between the growth and magnetic field directions, and an in-situ characterization apparatus. The portion disposed below the strong magnet includes a molecular beam source component such as evaporation source, plasma source etc., and a vacuum-pumping system. The present invention surmounts effectively the technical problems between the small volume of the strong magnetic field chamber and numerous components of the growth and test system, and realizes the molecular beam epitaxial growth and in-situ characterization under the strong magnetic field.

Molecular beam epitaxy under vector strong magnetic field and in-situ characterization apparatus thereof

A bonding electrode structure of a flip-chip LED chip includes: a substrate; a light-emitting epitaxial layer over the substrate; a bonding electrode over the light-emitting epitaxial layer, wherein the bonding electrode structure includes a metal laminated layer having a bottom layer and an upper surface layer from bottom up. The bottom layer structure is oxidable metal and the side wall forms an oxide layer. The upper surface layer is non-oxidable metal. The bonding electrode structure has a main contact portion, and a grid-shape portion surrounding the main contact portion in a horizontal direction. The problems during packaging and soldering of the flip-chip LED chip structure, such as short circuit or electric leakage, can thus be solved.

Bonding electrode structure of flip-chip led chip and fabrication method

A nitride white-light LED includes: a substrate; an epitaxial layer; an N-type electrode and a P-type electrode; channels are formed on the substrate and the epitaxial layer; temperature isolation layers are formed with low thermal conductivity material thereon to form three independent temperature zones (Zones I/II/III) on a single chip; temperature control layers are formed with high thermal conductivity material on the side wall of the epitaxial layer and the back surface of the substrate at Zones I/II/III, and control temperature of the epitaxial layer and the substrate; based on different thermal expansion coefficients, lattice constants of the nitride and the substrate at Zones I/II/III are regulated to adjust the biaxial stress to which the nitride; quantum wells change conduction band bottom and valence band top positions to change forbidden band widths and light-emitting wavelengths; the LED can emit red, green and blue lights by a single chip.

Nitride white-light light-emitting diode

Growing community of inventors

Xiamen, China

Junyong Kang