Huawei Technologies Co., Limited

Junying Zhao

Baoqi Wang

Fei Yu

Dan Jun Guo

Tongxin Zeng

Bin Xu

Bing Luo

Yuan Zhang

Shun Zhang

Mingli Huang

Zhihai Li

Guoliang Wang

Chong Chen

Xichen Yang

Fanhua Kong

Example optical connector ferrules and example optical connectors are provided. An example optical connector ferrule is a first ferrule of an optical connector, where the first ferrule includes n optical channels, and the first ferrule is configured to be compatible with a second ferrule. The second ferrule includes m optical channels, where both m and n are positive integers, and n is greater than m. The n optical channels of the first ferrule include first-type optical channels and second-type optical channels, where an arrangement manner of the first-type optical channels is the same as that of the m optical channels of the second ferrule, and at least one of the second-type optical channels is located in at least one of rows in which the first-type optical channels are located.

Optical connector ferrule and optical connector

A ferrule includes a ferrule matrix, an optical fiber, and a dielectric reflective film. The optical fiber is disposed in an accommodating through hole of the ferrule matrix, and the dielectric reflective film covers an optical transmission surface of the optical fiber and a surface that is of the ferrule matrix and that faces a matching ferrule. The dielectric reflective film has a through hole, such that the dielectric reflective film does not shield a main optical path area of the optical transmission surface of the optical fiber. A reflective band of the dielectric reflective film includes at least a part of a communication band of the optical fiber. In this way, when light from the matching ferrule is transmitted to the ferrule matrix and the optical fiber, the dielectric reflective film reflects the light.

Ferrule, optical connector, optical communication element, communications device, and preparation method

Embodiments of the present invention provide an optical module, including an MT-Ferrule and a photoelectric conversion unit. The MT-Ferrule is configured to connect multiple channels of optical channels outside the optical module with multiple channels of optical channels of the photoelectric conversion unit, and implement coupling and transmission of multiple channels of single-mode optical signals between the two. The photoelectric conversion unit is configured to convert multiple channels of single-mode optical signals input from the MT-Ferrule into multiple channels of electrical signals and output the multiple channels of electrical signals, and generate, driven by multiple channels of input electrical signals, multiple channels of single-mode optical signals and output the multiple channels of single-mode optical signals to the MT-Ferrule.

Optical module

An optical module manufacturing method includes: forming a first waveguide layer and a second waveguide layer on a first substrate and a second substrate respectively, or forming a first waveguide layer and a second waveguide layer on a first surface of a first substrate and a second surface of the first substrate respectively; disposing the first substrate on the second substrate; disposing a filter at an end of the first waveguide layer and the second waveguide layer, so that the filter is aligned with the second waveguide layer; and disposing a prism on the filter, so that a first reflective surface of the prism is aligned with the first waveguide layer, and a second reflective surface is aligned with the second waveguide layer. Embodiments of the present application further disclose an optical module.

Optical module manufacturing method and optical module

A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.

Multi-layer circuit board, method of manufacturing the same, and communication device

Growing community of inventors

Shenzhen, China

Junying Zhao