Dow Silicones Corporation

Dow Global Technolgoies LLC

Junying Liu

Bizhong Zhu

Joel McDonald

Ginam Kim

Steven Swier

William James Schulz, Jr

Nanguo Liu

Wei Rong

Kent R Larson

Takeaki Tsuda

Michael L Bradford

Gang Lu

Xianghuai Wang

Fengqiu Fan

David M Altergott

Brian R Harkness, Jr

Kent Larson

A dual curable organopolysiloxane composition is disclosed. The composition comprises: (A) a first organopolysiloxane having at least two mercapto (—SH) functional groups per molecule and free of an alkenyl group; (B) a second organopolysiloxane having at least one alkenyl group and at least one silicon atom-bonded alkoxy group per molecule; (C) optionally an organopolysiloxane having at least two alkenyl groups per molecule and free of silicon atom-bonded alkoxy group; (D) a photo-initiator; (E) a condensation catalyst; and (F) an epoxy functional compound. The composition has the ability to both photo-cure and cure through exposure to moisture, and exhibits good to excellent curability and long-term storage stability.

Dual curable organopolysiloxane composition

A composition contains: (a) a first organopolysiloxane with an average of 2 or more mercaptoalkyl groups per molecule and that is free of alkenyl functionality; (b) a second organopolysiloxane with an average of one or more alkenyl group and one or more alkoxy group per molecule; (c) a tetraalkoxy silane; (d) an ultraviolet light photoinitiator; and (E) a condensation catalyst; where the concentration of the first and second organopolysiloxanes are such that the molar ratio of mercaptoalkyl groups to alkenyl groups is in a range of 0.4 to 3.0.

UV/moisture dual cure composition with enhanced substrate adhesion

A composition contains (a) a silicon-free mercapto compound comprising 2 or more mercapto groups; (b) a linear polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group, 40 mole-percent or more phenyl groups relative to moles of silicon atoms and at least one alkoxysilyl group per molecule; (c) a resinous polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group and 20 mole-percent or more phenyl groups relative to moles of silicon atoms; (d) a photoinitiator; and (e) a moisture cure catalyst; and wherein the molar ratio of mercapto groups to terminally unsaturated alkenyl groups in the composition is in a range of 0.3 to 2.0.

Dual cure composition

A dual curable silicone composition, comprising: (a) a silicone resin comprising at least one epoxy group, (b) a silicone polymer comprising at least one epoxy group and at least one hydrolyzable group, (c) a catalytic amount of onium salt photo catalyst, (d) a catalytic amount of condensation catalyst, wherein the composition is curable when exposed to UV radiation, HO, or UV radiation and HO.

Dual curable silicone compositions

The present invention relates to organopolysiloxane compositions which exhibits both UV and moisture initiated curing.

Dual cure organopolysiloxane composition

Various embodiments disclosed related to a release layer including at least one fluorosilicon compound, and to related aspects such as methods for display device substrate processing. In various embodiments is a method of processing a display device substrate. The method can include securing the display device substrate to a carrier substrate with an adhesive delamination layer and a release layer between the adhesive delamination layer and the display device substrate. The release layer includes a cured product of a precursor release layer composition. The precursor release layer composition includes at least one fluorosilicon compound.

Release layer including at least one fluorosilicon compound

An adhesive delamination layer including at least one non-linear organopolysiloxane and methods for display device substrate processing are disclosed. The method includes securing the display device substrate to a carrier substrate with an adhesive delamination layer including a cured product of curing a precursor adhesive composition. The precursor adhesive composition includes Component (A), a hydrogenorganopolysiloxane and Component (B), a (C-C)alkenyl-functionalized organopolysiloxane, wherein the (C-C)alkenyl group is uninterrupted or interrupted by 1, 2, or 3 groups independently chosen from &#x2014;O&#x2014;, &#x2014;S&#x2014;, substituted or unsubstituted &#x2014;NH&#x2014;, &#x2014;(O&#x2014;(C-C)alkylene)- wherein n is 1 to 1,000, &#x2014;Si((C-C)alkoxy)-, and &#x2014;Si((C-C)alkyl)- wherein at least one of Component (A) and Component (B) is non-linear.

Adhesive delamination layer including at least one non-linear organopolysiloxane

An optical element comprises an antireflective layer that is disposed on and in contact with a substrate. The antireflective layer has a refractive index of greater than 1 to less than 1.41 and has a pore size ranging from greater than 0 to less than 300 nm. The antireflective layer includes an outermost surface having a water contact angle ranging from greater than or equal to 70&#xb0; to less than or equal to 120&#xb0; as determined using ASTM 5946-04.

Optical element

A hydrophobic article includes a substrate and a nanoparticle layer disposed on the substrate and including nanoparticle agglomerates wherein the nanoparticle agglomerates have an average volume based size of at least 100 nanometers as determined using light scattering via ISO 13320. The hydrophobic article also includes a binder layer disposed on and in direct contact with the nanoparticle layer and including an oxidatively cured product of a silicon-based resin and an outermost layer that is disposed opposite the substrate and on and in direct contact with the binder layer. The hydrophobic article has a water contact angle of greater than or equal to 90 degrees as measured on the outermost layer of the hydrophobic article and determined using modified ASTM D5946-04.

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Midland, MI, United States of America

Junying Liu