Rohm Co., Ltd.

Junya Yamagami

Yasuhiro Kondo

Katsuya Matsuura

Keishi Watanabe

Hiroyuki Okada

Keisuke Fukae

Takahiro Arakawa

The present disclosure provides a diode chip capable of attaining excellent electrical characteristics. The present disclosure provides a diode chip (), including: a semiconductor chip () having a first main surface (); a first pin junction portion () formed on a surface of the first main surface () with a first polarity direction; a first diode pair () (rectifier pair) including a first pn junction portion () separated from the first pin junction portion () and formed in the semiconductor chip () with the first polarity direction and a first reversed pin junction portion () connected to the first pn junction portion () in reversed direction and formed on the first main surface () with a second polarity direction; and a first junction separation trench () formed on the first main surface () in a manner of separating the first pin junction portion () and the first diode pair ().

Diode chip

A bidirectional Zener diode includes a substrate, a first conductivity type base region formed at a front surface portion of the substrate, a second conductivity type first impurity region formed at the base region, a second conductivity type second impurity region formed at the base region away from the first impurity region, an insulating layer formed on a front surface of the substrate, a first electrode film formed on the insulating layer and electrically connected to the first impurity region, and a second electrode film formed on the insulating layer and electrically connected to the second impurity region, and a first region formed on the insulating layer, the first region being sandwiched between the first electrode film and the second electrode film, and the first region including a portion having an aspect ratio of 1 or larger.

Bidirectional Zener diode and method for manufacturing bidirectional Zener diode

A filter chip includes a substrate, a plurality of external terminals formed on the substrate for external connection, and a plurality of passive element forming regions provided in the regions between the plurality of external terminals in plan view when viewed along a direction normal to the surface of the substrate, the plurality of passive element forming regions including at least a resistor forming region where a resistor is formed. The resistor forming region includes a resistive conductive film formed on the substrate with one end and the other end thereof electrically connected to different ones of the external terminals, and a fuse portion integrally formed with the resistive conductive film. The fuse portion is cuttably provided to electrically connect a part of the resistive conductive film to the external terminals, or to electrically separate a part of the resistive conductive film from the external terminals.

Growing community of inventors

Kyoto, Japan

Junya Yamagami