Nec Corporation

Japan Aviation Electronics Industry, Limited

Honda Motor Co., Ltd.

Nichias Corporation

Fuji Xerox Co., Ltd.

Yamato Protec Corporation

Lenovo Innovations Limited

Junya Sato

Ryosuke Mitsui

Shinji Watanabe

Nobuhiro Mikami

Atsumasa Sawada

Atsushi Tanaka

Kazuhito Hotta

Yoshiaki Yamabayashi

Katsumi Abe

Yoshiyuki Hashimoto

Takashi Udono

Nozomu Nishimura

Kenichiro Fujii

Yuji Kashiwabara

Yasuhiro Sasaki

Toru Taura

Takeru Abe

Yoshifumi Fujita

Nobuya Tomosue

Ryuta Niimura

Kazutoshi Isomura

Kosuke Matsuo

Junichiro Suzuki

Akihiro Yoshimura

Shinichiro Nakajima

Masakazu Koizumi

Tomohiro Tsutsumi

Noriyuki Mishina

Noboru Asada

A module is provided with a structural object and a connection member. The structural object is provided with an electronic device and a resin portion. The electronic device has an electrode. The electronic device is embedded in the resin portion. The electrode is exposed from the resin portion. The connection member is provided with a film-like base member, an adhesive layerprovided on the film-like base member and a wiring formed on the adhesive layer at least in part. The connection member is stuck to the structural object. At least a part of the resin portion of the structural object is directly stuck to the adhesive layer of the connection member. The wiring is pressed to the electrode of the electronic device.

Module and manufacturing method of the same

In a mounting structure in which an electronic component is mounted on a wiring board, a wiring sheet including an adhesive layer interposes between the electronic component and the wiring board and the electronic component is indirectly mounted on the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet and the adhesive layer of the wiring sheet is directly fitted to the wiring board. Conduction between the electronic component and the wiring board is attained by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board.

Method for manufacturing mounting structure for electronic component, mounting structure for electronic component, electronic module, and wiring sheet

In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

Electrical connection device, method for producing the same, and structure of flexible wiring board

An exhaust muffler has an outer cylinder into which an exhaust gas from an engine is introduced and a muffling member made of a foamed ceramic material. The outer cylinder has an inner cylinder through which the exhaust gas passes, a part of the muffling member is supported by an outer wall of the inner cylinder via a holding member. The inner cylinder includes, in an area where the inner cylinder overlaps with the muffling member with respect to axial direction of the inner cylinder, a porous wall portion formed with communication holes communicating an inside and an outside of the inner cylinder. The holding member is arranged at a position where it does not overlap with a part of the porous wall portion, so that muffling effect is enhanced, and the muffling member having a low resistance to impact forces can be supported stably by the inner cylinder.

Exhaust muffler

In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.

Film surface sound receiving type sound sensor module

A cylinder bore wall thermal insulator is installed in a groove-like coolant passage of a cylinder block having cylinder bores in an internal combustion engine to insulate the entire bore wall of all the cylinder bores or part of the bore wall of all the cylinder bores. The thermal insulator includes: a base member made of a synthetic resin and having a shape conforming to the shape of the groove-like coolant passage at the installation position of the thermal insulator; a cylinder bore wall thermal insulating member formed of a heat-expandable rubber and affixed to the inside of the base member; and a cylinder bore opposite wall contact member formed of a heat-expandable rubber and affixed to the outside of the base member. A thermal insulator can be obtained which is less likely to be displaced in the groove-like coolant passage, and is readily manufactured.

Cylinder bore wall thermal insulator, internal combustion engine, and automobile

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

Electric connection structure and electric connection member

A cylinder bore wall thermal insulator includes a base member made of synthetic resin and having a shape conforming to a shape of the groove-like cooling water channel in a setting position of the thermal insulator, an opening for heat-sensitive expanding rubber swelling for heat-sensitive expanding rubber disposed on a rear surface side to pass through a base member during heat-sensitive expansion being formed in a position opposed to an insulating part of a cylinder bore wall, heat-sensitive expanding rubber disposed on the rear surface side of the base member and covering the opening for heat-sensitive expanding rubber swelling, and a rear-surface metal plate covering the rear surface side of the heat-sensitive expanding rubber, fixed to the base member, and holding an outer edge portion of the heat-sensitive expanding rubber between the rear-surface metal plate and the base member to thereby fix the heat-sensitive expanding rubber to the base member. An urging member for urging the heat-sensitive expanding rubber after the heat-sensitive expansion toward the cylinder bore wall is attached to the rear-surface metal plate. According to the present invention, it is possible to provide a thermal insulator that has high adhesion to a wall surface on a cylinder bore side of a groove-like cooling water channel, less easily causes positional deviation in the groove-like cooling water channel, and is easily manufactured.

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board, a semiconductor packageis mounted on a curved boardincluding a curved surface on at least a portion thereof. The curved boardincludes a pedestal portiondisposed on a region of the curved surface portion where the semiconductor packageis mounted and having an upper surface thereof formed flat, and a plurality of pad portionsdisposed on the flat surface of the pedestal portion. The pedestal portionis formed of an insulating material. The semiconductor packageis mounted on the pad portions

Mount board and electronic device

Provided is a circuit board device in which printed wiring boardsare connected to each other electrically using a anisotropic conductive memberdisposed between the printed wiring boards. The anisotropic conductive membercomprises: an insulating elastic resin material; fine metal wireshaving a middle portion embedded within the insulating elastic resin materialso as to connect corresponding connecting terminals of the printed wiring boards; and resin layersexhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boardsand anisotropic conductive memberis curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive membermade to conform to curvature of the printed wiring boards

Circuit board device and circuit board module device

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount boarda semiconductor packageis mounted on a curved boardincluding a curved surface on at least a portion thereof. The curved boardincludes a pedestal portiondisposed on a region of the curved surface portion where the semiconductor packageis mounted and having an upper surface thereof formed flat, and a plurality of pad portionsdisposed on the flat surface of the pedestal portionThe pedestal portionis formed of an insulating material. The semiconductor packageis mounted on the pad portions

Electronic components on a printed wiring board can be protected from the impact force of a fall, whereby the electrical and mechanical reliability of the electronic apparatus components can be greatly improved, and moreover, smaller size, lighter weight, higher functionality, and greater multifunctionality can be achieved. The composite multilayer wiring board of the present invention includes a plurality of intermediate layers each interposed between a plurality of printed wiring boards, at least one of the plurality of intermediate layers being composed of a resin material having a dilatancy characteristic.

Composite multilayer wiring board

The present invention relates to a holding material for a catalytic converter including a catalyst carrier, a metal casing for receiving the catalyst carrier, and the holding material wound around the catalyst carrier and interposed in a gap between the catalyst carrier and the metal casing, the holding material having a plurality of high-density sites which are spaced apart from one another in the holding material, each site having a higher density than sites of the holding material in which the higher density sites are not provided.

Growing community of inventors

Tokyo, Japan

Junya Sato