Tokyo Electron Limited

Junya Oka

Hideaki Yamasaki

Takamichi Kikuchi

Kohichi Satoh

Shinya Okabe

Motoko Nakagomi

Yuuji Kobayashi

There is provided a substrate mounting table for use in a plasma-based processing apparatus that performs a plasma-based process on a substrate inside a processing container, which includes a substrate mounting portion having a front surface subjected to a mirroring treatment and on which the substrate is mounted, and an edge portion located around the substrate mounting portion and treated to have an uneven shape.

Substrate mounting table

There is provided a method of performing a surface treatment with respect to a metal mounting table for mounting a substrate to be plasma-processed, the mounting table functioning as a lower electrode configured to generate a plasma by a high frequency power applied between an upper electrode and the lower electrode. The method includes: performing a first surface treatment by spraying a non-sublimation blast material as a non-sublimation material onto a mounting surface of the metal mounting table on which the substrate is mounted, followed by a second surface treatment by spraying a sublimation blast material as a sublimation material onto the mounting surface.

Method of performing a surface treatment on a mounting table, the mounting table and a plasma processing apparatus

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Nirasaki, Japan

Junya Oka