Sumitomo Bakelite Company Limited

Promerus, Lcc

Junya Kusunoki

Takashi Hirano

Toyosei Takahashi

Masakazu Kawata

Rie Takayama

Edmund Elce

Robert A Shick

Hendra Ng

Brian F Knapp

Mitsuo Sugino

Christopher Apanius

Etsu Takeuchi

Hiromichi Sugiyama

Kazuto Oonami

Matthew Apanius

Toshiharu Kuboyama

Hirohisa Dejima

Seiji Oohashi

To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same

A method of manufacturing a light receiving deviceincludes: providing a resin layercontaining a photo curing resin on a transparent substratewhere a plurality of transparent substrate portionsA are integrated so that the resin layer covers the transparent substrate; selectively irradiating the resin layerwith light, followed by a developing process, so that the resin layerremains in regions of the transparent substratewhich surround portions corresponding to regions facing light receiving portionsin the transparent substrate portionsA; dividing the transparent substrateinto units of transparent substrate portionsA so that a plurality of transparent substrate portionsA are obtained; dividing the base substrateinto units of base substrate portionsA so that a plurality of base substrate portionsA are obtained; and joining the base substrate portionsA and the transparent substrate portionsA via the resin layer

Method of manufacturing light receiving device

Vinyl addition polymer compositions, methods for forming such compositions, methods for using such compositions to form microelectronic and optoelectronic devices are provided. The vinyl addition polymer encompassed by such compositions has a polymer backbone having two or more distinct types of repeat units derived from norbornene-type monomers independently selected from monomers of Formula I: wherein each of X, m, R, R, R, and Ris as defined herein and wherein a first type of repeat unit is derived from a glycidyl ether substituted norbornene monomer and a second type of repeat unit is derived from an aralkyl substituted norbornene monomer.

Photosensitive compositions based on polycyclic polymers for low stress, high temperature films

A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer.

Resin composition, filling material, insulating layer and semiconductor device

Disclosed is a semiconductor wafer which is characterized in that a resin layer composed of a resin composition containing a cyclic olefin resin (A) having an epoxy group and a photoacid generator (B) is arranged on a surface on which a circuit element is formed, and the residual stress of the resin layer after curing is 1-20 MPa. Also disclosed is a semiconductor device comprising such a semiconductor wafer.

Semiconductor wafer and semiconductor device

Disclosed is a semiconductor device having a wafer level package structure which is characterized by containing a resin layer composed of a resin composition which is curable at 250&#xb0; C. or less. Such a semiconductor device having a wafer level package structure is excellent in low stress properties, solvent resistance, low water absorbency, electrical insulation properties, adhesiveness and the like.

Semiconductor device

Growing community of inventors

Tokyo, Japan

Junya Kusunoki