Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Junya Ida

Hiroyuki Furutani

Hirosaku Nagano

Yoshifumi Okamoto

Hitoshi Nojiri

Kazuhisa Danno

Naoki Hase

Shinji Inoue

Yoshihide Oonari

Thermally fusible adhesive copolymer, articles made therefrom, and

The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular. The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Thermoplastic polyimide, polyamide acid, and thermally fusible laminated

Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide

The invention discloses a thermosetting imide oligomer represented by the general formula (1A) or (1B): ##STR1## Where Ar.sub.1 indicates a tetravalent aromatic group, Ar.sub.2 indicates a divalent aromatic group, Ar.sub.1 or Ar.sub.2 can be of the same or different kind, X indicates a trivalent group and it can be of the same or different kind, n is an integer selected from 1 to 15, and R is a substitution group having reactivity. The invention further discloses a method for manufacturing a heat resistant laminated sheet using the imide oligomer, which is excellent in heat resistance, hygroscopic resistance and electric properties.

Thermosetting imide oligomer and manufacturing method of heat resistant

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Otsu, Japan

Junya Ida