Shenzhen Goodix Technology Co., Ltd.

Huawei Technologies Co., Limited

Junping Luo

Wei Pan

Shanshan Zeng

Penghui Wang

Pingyu Wu

A link negotiation system includes a second device that determines a link configuration policy based on a status of a receiver of an interface of the second device, where the link configuration policy indicates an association relationship between a unidirectional logical lane and a unidirectional physical lane in a high-speed serial link between a first device and the second device, the unidirectional logical lane is a logical lane from the first device to the second device in the high-speed serial link, and the unidirectional physical lane is a physical lane from the first device to the second device in the high-speed serial link; and sends the link configuration policy to the first device.

Link negotiation system, method, and device

A fingerprint chip package and method for processing same, relating to a field of biometric identification. The fingerprint chip package includes: a lead frame (), a chip (), and a plastic packaging part enclosing the lead frame () and the chip (); the lead frame () comprises a base island (), a connecting rib (), and a golden finger (); the base island () is used for bearing the chip (); the connecting rib () is used for supporting the lead frame () and connecting the base island () via the golden finger (); and the golden finger () is used for fixing the base island () and electrically connecting with the chip ().

Fingerprint chip package and method for processing same

A chip packaging structure comprises a die, a carrier, a die attach film, and a plastic package body. The die attach film is disposed on the bottom surface of the die, with a thickness of the die attach film being greater than or equal to 40 micrometers. The die is disposed on the carrier via the die attach film; and the plastic package body is disposed on the carrier and coats a top surface and side surfaces of the die, whereby the overall impact resistance of a chip is improved without changing the structure of the carrier, the expense for making a mold is saved, and moreover, the packaging structure is simple and easy for mass production.

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Shenzhen, China

Junping Luo