Samsung Electronics Co., Ltd.

Junpil Kim

Jinho Kim

Sungho Cho

Hangyu Hwang

Changsu Kim

Sangsik Na

Hyunjung Jung

Jinshik Lim

Yeonghwan Gong

Jungho Hwang

According to certain embodiments, an electronic device housing comprises: a substrate including: a front surface comprising a plurality of front surface protrusions and a plurality of taper protrusions protruding from the plurality of front surface protrusions and a rear surface comprising a plurality of rear surface protrusions; and wherein two protrusions selected from the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions are different from each remaining ones of the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions; a deposition layer formed on the front surface of the substrate; and a transparent coating layer formed on the rear surface of the substrate.

Electronic device housing with protrusions and electronic device including the same

Growing community of inventors

Gyeonggi-do, South Korea

Junpil Kim