Tokyo Electron Limited

Northwestern University

King Abdulaziz City for Science and Technology

Junling Sun

Angelique Denise Raley

Andrew W Metz

James Fraser Stoddart

Lior Huli

Cory Wajda

Katie Lutker-Lee

J Fraser Stoddart

Zhichang Liu

Marco Frasconi

Alyssa-Jennifer Avestro

Zachary B Erno

Yuping Wang

Dongyang Chen

Methods and improved process flows are provided herein for forming self-aligned contacts using spin-on silicon carbide (SiC). More specifically, the disclosed methods and process flows form self-aligned contacts by using spin-on SiC as a cap layer for at least one other structure, instead of depositing a SiC layer via plasma vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), etc. The other structure may be a source and drain contact made through the use of a trench conductor. By utilizing spin-on SiC as a cap layer material, the disclosed methods and process flows avoid problems that typically occur when SiC is deposited, for example by CVD, and subsequently planarized. As such, the disclosed methods and process flows improve upon conventional methods and process flows for forming self-aligned contacts by reducing defectivity and improving yield.

Methods for forming self-aligned contacts using spin-on silicon carbide

A method for forming a device includes forming a hole pattern in a resist layer disposed over a substrate. The substrate includes contact regions disposed over a major surface of the substrate and a dielectric layer disposed over the contact regions. The resist layer is disposed over the dielectric layer and the hole pattern includes through openings in the resist layer that are aligned with the contact regions. The through openings include a first through opening having a first critical dimension and a second through opening having a second critical dimension greater than the first critical dimension. The method includes modifying the hole pattern by depositing a material including silicon within the through openings by exposing the hole pattern to a first plasma generated from a gas mixture including SiCland hydrogen, and then etching holes in the dielectric layer through the modified hole pattern, exposing the contact regions.

Forming contact holes with controlled local critical dimension uniformity

Systems and methods are provided herein for etch features on a substrate, while maintaining a near-unity critical dimension (CD) shrink ratio. The features etched may include, but are not limited to contacts, vias, etc. More specifically, the techniques described herein use a pulsed plasma to control the polymer build-up ratio between the major CD and minor CD of the feature, and thus, control the CD shrink ratio when etching features having substantially different major and minor dimensions. The CD shrink ratio is controlled by selecting or adjusting one or more operational parameters (e.g., duty cycle, RF power, etch chemistry, etc.) of the plasma etch process(es) to control the amount of polymer build-up at the major and minor dimensions of the feature.

Systems and methods to control critical dimension (CD) shrink ratio through radio frequency (RF) pulsing

A process is provided in which etched layer(s) are protected from residues or defects caused by or resulting from exposure to atmospheric conditions. Protection is provided through the formation of an encapsulation layer post etch. In one embodiment, the encapsulation is provided by a thin layer formed in an atomic layer deposition (ALD) process. The thin layer prevents the etched layer(s) from exposure to air. This encapsulation process may take place after the etch process thus allowing for substrates to be subsequently exposed to atmospheric conditions with little or no queue time constraints being needed for staging subsequent wet clean processing steps. In one embodiment, the encapsulation process may be performed with no vacuum break between the etch process and the encapsulation process. In one embodiment, the encapsulation film is compatible with subsequent wet process steps and can be removed during this wet process steps without adverse effects.

Method utilizing using post etch pattern encapsulation

Provided herein are systems and devices comprising rigid macrocyclic and nanoporous compositions of electronically coupled naphthalenediimide redox-active units and methods of preparation and use thereof, for example, in the field of energy generation and storage.

Rigid naphthalenediimide triangle structures

Provided herein are mechanically interlocked air-stable persistent organic radicals. The radical compositions may access a multiplicity of radical, cationic redox states as well as a fully cationic redox state. A composition comprises a first ring mechanically interlocked with a second ring or a salt thereof, wherein the first ring comprises a 4,4'-bipyridinium subunit or a derivative thereof and a diazapyrenium subunit or a derivative thereof and the second ring comprises a 4,4&#x2032;-bipyridinium subunit or a derivative thereof. In some embodiments, the second ring further comprises a diazapyrenium subunit or a derivative thereof. Methods of preparing the compositions are also provided.

Mechanically interlocked air-stable radicals

Disclosed herein are nanoactuating rotaxanes comprising a threading component, the threading component comprising a oligoviologen, and at least two macrocylic components, wherein the oligoviologen is threaded through each of the macrocylic components. Also disclosed are methods for making and using the rotaxanes.

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Albany, NY, United States of America

Junling Sun