Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Junling Pang

Jisong Jin

Yanhua Wu

Jia Ni

Zejun He

A semiconductor device and its fabrication method are provided. The method includes providing a layer to be etched; forming a first mask layer on the layer to be etched; forming a first trench and a second trench in the first mask layer; forming a blocking layer over the first mask layer, where a portion of the blocking layer is formed in a first portion of the first trench and a first portion of the second trench; forming a first dividing layer in a first blocking opening to divide the first trench along a first direction; when forming the first dividing layer, forming second dividing layers on two sidewalls of a second blocking opening and arranged along the first direction, where the second dividing layers divide the second trench along the first direction; and after forming the first dividing layer and the second dividing layers, removing the blocking layer.

Semiconductor device and fabrication method thereof

A semiconductor device and a method for forming the semiconductor device are provided. The method includes providing a layer to-be-etched including a first sub-trench region and a second sub-trench region. The method also includes forming a first mask layer over the layer to-be-etched and a second mask layer over the first mask layer, and forming a first sub-trench disposed over the first sub-trench region in the second mask layer. In addition, the method includes forming a first divided trench in the first mask layer and forming a second sub-trench disposed over the second sub-trench region in the second mask layer. Further, the method includes forming a first divided filling layer in the first divided trench, and forming a first middle trench in the first mask layer. The first divided filling layer divides the first middle trench in a second direction.

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Shanghai, China

Junling Pang