Suzhou China Star Optoelectronics Technology Co., Ltd.

China Wafer Level Csp Ltd.

China Wafer Level Csp Co., Ltd.

Junjie Li

Wei Wang

Guoqing Yu

Qiuhong Zou

Dan Cao

Wenbin Wang

Zhiqi Wang

Qiong Yu

Lu Chen

Qiong Liu

Ying Yang

Bangyin Peng

Dazhao Wu

Junfang Lv

The present application provides a light-emitting substrate and a display device. The light-emitting substrate includes a driving substrate, a light guide functional layer and a reflective layer. The driving substrate is provided with multiple light-emitting devices and multiple support columns. The reflective layer is disposed on the driving substrate and arranged between the light-emitting devices. The reflective layer includes a reflective body and multiple low-reflection units. Each low-reflection unit is arranged around one support column. The reflective layer has greater reflectivity at a position of the reflective body than at a position of each low-reflection unit.

Light-emitting substrate and display device

A display panel includes a first substrate, a second substrate, a liquid crystal layer, and a first polarizing layer disposed corresponding to the first substrate. The first polarizing layer includes a first sublayer, a second sublayer, and a first polarizing material layer disposed between the first sublayer and the second sublayer. The first sublayer has a first shrinkage force, the second sublayer has a second shrinkage force, and the shrinkage direction of the first shrinkage force is parallel to the shrinkage direction of the second shrinkage force.

Display panel comprising a polarizing layer having first and second sublayers each having a shrinkage force with a shrinkage direction, method of manufacturing a display panel, and display device

A display device is provided. The display device includes a back frame, a display module, and a polarizer. The back frame has a cavity, and the display module is disposed in the cavity. The polarizer is arranged on the display module and a body of the back frame surrounding the display module. The polarizer is extended to the back frame in the non-display area, thereby removing a front frame in the prior art, reducing a thickness of the display device, and increasing an area of the display area.

Display device

A chip package and a method for forming the same are provided. The method includes: providing a first chip, wherein the first chip comprises a first surface and a second surface, and a first plurality of pads are disposed on the first surface; providing a second chip, wherein the second chip comprises a third surface and a fourth surface, a second plurality of pads are disposed on the third surface; combining the second surface of the first chip and the third surface of the second chip, wherein the second plurality of pads are out of the combination area of the first chip and the second chip; and forming a first insulation layer, wherein the first insulation layer covers the first chip, and is combined with the second chip. Processes of the method are simple, and the chip package is small.

Chip to wafer package with top electrodes and method of forming

A wafer-level package structure of a light emitting diode and a manufacturing method thereof are provided in the present invention. The wafer-level package structure of a light emitting diode includes a die, a first insulating layer, at least two wires, bumps, an annular second insulating layer on the wires and the insulating layer, the annular second insulating layer surrounding an area between the bumps and there being spaces arranged between the second insulating layer and the bumps; a light reflecting cup on the second insulating layer; at least two discrete lead areas and leads in the lead areas. The technical solution of the invention reduces the area required for the substrate; and the electrodes can be extracted in the subsequent structure of the package without gold wiring to thereby further reduce the volume of the package.

Wafer-level package structure of light emitting diode and manufacturing method thereof

A wafer-level package structure of a light emitting diode and a manufacturing method thereof, and the package structure includes: a die including a first side and a second side opposite to the first side; a first insulating layer on the first side of the die; at least two wires which are arranged on the insulating layer and electrically isolated from each other; bumps which are arranged on the wires and adapted to be electrically connected correspondingly with electrodes of a bare chip of the light emitting diode; at least two discrete lead areas on the second side of the die; and leads in the lead areas, electrically isolated from each other and electrically connected correspondingly with the wires. The invention forms the leads on the second side of the substrate to extract the electrodes of the light emitting diode, that is, the light emitting diode and the leads thereof are located on the two opposite sides of the substrate in the technical solution of the invention, to thereby reduce the area required for the substrate; and the electrodes can be extracted in the subsequent structure of the package without gold wiring to thereby further reduce the volume of the package.

Growing community of inventors

Suzhou, China

Junjie Li