Spansion Llc.

Valley Device Management

Cypress Semiconductor Corporation

Other

Sumitomo Bakelite Company Limited

Oryza Oil & Fat Chemical Co., Ltd.

Asahi Glass Company, Limited

Nippon Paper Industries Co., Ltd.

Keio University

Kawasaki Kasei Chemicals Ltd.

Junji Tanaka

Masanori Onodera

Kouichi Meguro

Koji Taya

Junichi Kasai

Yasuhiro Shinma

Masahiko Harayama

Tatsuya Andoh

Tetsuji Shimohira

Hiroshi Shimoda

Naomi Masuda

Yasunori Nanri

Keigo Watanabe

Hiromichi Murai

Murugasan Manikam Achari

Hideki Goto

Shigeru Nakamura

Hiroshi Yamakawa

Kazuo Tsubota

Toshimi Yajima

Toshimasa Eguchi

Masaaki Konishi

Masahiro Tsuchiya

Tadashi Okada

Makoto Nakao

Takashi Kadekaru

Shaojie Shan

Toshihiro Imada

Shinji Ohno

Tsuyoshi Takenaka

This invention provides a prophylactic and therapeutic agent for dry eye, having new ingredients to reduce the deterioration of the lacrimal secretory ability and to inhibit the generation of radical oxygen in lacrimal gland tissue. The prophylactic and therapeutic agent for dry eye of this invention contains the maqui berry extract as the active substance of this invention, i.e. containing delphinidin glycoside extracted from the maqui berry and at least one or more of the active substances delphinidin-3-sambubioside-5-glucoside, delphinidin-3,5-diglucoside, delphinidin-3-sambubioside and delphinidin-3-glucoside, preferably delphinidin-3,5-diglucoside.

Method of improving lacrimal secretion for dry eye treatment using maqui berry extract

Various embodiments of the present disclosure include a non-volatile memory semiconductor device and a device that uses the same, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present disclosure, it is possible to provide a high-quality semiconductor device, in which downsizing and cost reduction can be realized.

Non-volatile memory with stacked semiconductor chips

Non-volatile memory and devices that use the same

Various embodiments of the present invention include a method for making a semiconductor device the method including disposing a first semiconductor chip on a first surface of a first substrate, the first substrate comprising a second surface opposing the first surface, depositing a first resin above the first semiconductor chip, disposing a built-in semiconductor device on the first resin. The built-in semiconductor device including a second substrate, a second semiconductor chip disposed on the second substrate, and a second resin that seals the second semiconductor chip. The method including depositing a third resin above the built-in semiconductor device and the first resin and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device fabrication method, in which downsizing and cost reduction can be realized.

Methods for making semiconductor device with sealing resin

A method of fabricating a semiconductor device includes the steps of providing a heat-resistant sheet on an interposer so as to cover electrode terminals provided on the interposer, and sealing a semiconductor chip on the interposer sandwiched between molds with a sealing material. The electrode terminals are covered by the heat-resistant resin for protection, and the semiconductor chip is then sealed with resin. It is thus possible to avoid the problem in which contaminations adhere to the electrode terminals. This makes it possible to prevent the occurrence of resin burrs on the interposer and contamination of the electrode pads and to improve the production yield.

Method of fabricating a semiconductor device used in a stacked-type semiconductor device

A semiconductor device includes a first insulator film having a first opening, a first wiring layer extending from the first opening onto the first insulator film, a first semiconductor chip mounted on the first insulator film so as to be electrically coupled with the first wiring layer, and a resin portion applied on the first insulation film to cover the first semiconductor chip.

Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same

A method of producing a carrier structure for fabricating a stacked-type semiconductor device includes laminating thin plates for a lower carrier associated with an upper carrier. The method includes forming openings in the thin plates by etching or electric discharge machining. The lower carrier includes a magnet that is buried therein and the magnet maintains contact between the lower carrier and the upper carrier. A thin plate of the laminated thin plates is provided on each opposing surface of the magnet. The lower carrier further includes multiple magnets arranged around a periphery of the lower carrier and through a center region of the lower carrier that is between magnets on the periphery.

Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device

Various embodiments of the present invention include a semiconductor device, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device, in which downsizing and cost reduction can be realized.

Semiconductor device with sealing resin

The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

Semiconductor device and programming method

Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.

Semiconductor device having a simplified stack and method for manufacturing thereof

Various embodiments of the present invention include a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.

Methods of making a semiconductor device

Semiconductor device

Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.

Structure, method and system for assessing bonding of electrodes in FCB packaging

Growing community of inventors

Tokyo, Japan

Junji Tanaka