The Furukawa Electric Co., Ltd.

Other

The Furukawa Construction Co., Ltd.

The Fukura Electric Company, Ltd.

Junji Sotani

Chiyoshi Sasaki

Masaru Ohmi

Tatsuya Koizumi

Yasuhiro Ootori

Hiroaki Maekawa

Toshikatsu Hama

Isao Tsukada

Toru Arimoto

Shiro Endo

Susumu Seo

Naoki Mori

Yuichi Kimura

Hajime Noda

Toshiyuki Kato

Suemi Tanaka

Shuichi Furuya

Kagetoshi Onodera

Kuniyoshi Sato

Tohru Ohi

Minoru Mabuchi

Hajima Noda

Kuniyoshi Satoh

Kenichi Nanba

Akiji Katsura

Masauki Momo

Nobuyoshi Mashino

Tetsuo Okuyama

A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin

A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.

Heat pipe hinge structure for electronic device

A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.

A heat pipe type radiator is formed with a cooling plate mounted on an evaporative section of a heat pipe and a flat heat conductive plate mounted on a condenser section. Heat-generating electronic components are brought into contact with the cooling plate and a radiation fin molded from a thin plate in a wave form is mounted on both surfaces of the heat conductive plate. Other embodiments of the radiation fin include a skived fin formed by skiving a flat plate in an arch form, a pin fin and a wire fin which are composed of and so forth. Since each of these fins has the large surface area for heat radiation per unit volume and is small in weight, it is suitable to use for a heat pipe type radiator for an electronic apparatus. The heat generated in the electronic components transported to the heat conductive plate through the cooling plate and the heat pipe is radiated from the entire surface of the radiation fin to the ambient air. The heat conductive plate is molded in a flat form and, therefore, the heat generated in the electronic components can conduct to the portion most remote from the heat pipe. Further, since the radiation fin has a large surface area for heat radiation per unit volume, the heat radiation capability is improved.

Heat pipe type radiation for electronic apparatus

An electrical wiring material having a cooling function is characterized by a long hollow conductive body within which operating fluid is internally confined. An electrical connection piece is provided at the end portions of the conductive body, or other portions thereof. When used to wire electronic apparatuses, resulting heat is radiated due to evaporation and condensation of the operating fluid within the hollow conductive body. The wiring material may be used to wind a transformer, particularly the low voltage side, to provide a self cooling transformer.

Electrical wiring material and transformer

A pipe for a cooling unit comprises an outer pipe, and an inner pipe shorter than the outer pipe and located at an evaporating portion in the outer pipe, a circulation gap being defined between the inner wall surface of the outer pipe and the outer wall surface of the inner pipe and leading from one end to the other end of the inner pipe, whereby working liquid is permitted to boil up continuously and stably in the evaporating portion even uder a low temperature flow of working liquid. Also, a cooling unit comprises a plurality of pipes for the cooling unit as noted above, which are arranged as standing side by side vertically or obliquely, and upper and lower header pipes communicating to the upper and lower ends of these pipes, respectively, whereby the thermal conductivity is increased even under the low temperature flow of working liquid, and a plurality of portions to be individually cooled are permitted to be cooled down in case of employment of a heat pipe cooling system for cooling, even if the levels of these portions differ from each other. An individual cooling system comprises a plurality of cooling units as noted above to circulate the refrigerant, whereby a plurality of partitioned spaces are permitted to be cooled down individually and efficiently.

Pipe for cooling unit, cooling unit and individual cooling system

A hot plate comprises a rectangular lower section having a heating chamber formed therein, and an upper section erected upward at the back end of the lower section and having a gas chamber formed therein. The gas chamber has a gas staying or receiving space located above the heating chamber. A liquid contained in the heating chamber is heated by a gas burner so that it is gasified into heated gas to heat a heating surface of the lower section. of the hot plate. Non-condensed gas created from the heated liquid is gathered in the gas staying or receiving space.

Hot plate

A heat pipe type heat-exchanger for ventilation is disclosed, having a plurality of heat pipes affixed with widely spaced fins provided internally in a box like case and arranged horizontally relative to the case, a partition plate dividing the inside of the case into two chambers on the right and left is provided crossing the heat pipes, an inlet and an outlet are formed for the respective chambers of the case, and fans for circulating the air to the respective chambers in opposite directions through the inlets and outlets are provided to make one chamber always an air-supplying chamber and other chamber always an air-discharging chamber. The connection point of power source wires of the fan motors is placed in the air-supplying chamber.

Heat pipe type heat-exchanger for the ventilation

The present invention proposes a heat pipe heat exchanger comprising a hot gas flow duct, a cold gas flow duct and a plurality of heat pipes each with spiral fins around thereof that are installed horizontally a little slanted so that an end of each heat pipe in said hot gas flow duct becomes a little lower than the other end, and that said spiral fins are winding clockwise around some of the heat pipes and counter-clockwise around some other heat pipes. This device can prevent a bias flow of the steel balls at the so-called shot cleaning process performed for elimination of dust deposited on the heat pipes by arranging a layout of the two kinds of heat pipes, namely the heat pipes with clockwise winding fins around thereof and the heat pipes with counter-clockwise winding fins, and if required, can even control the flow of the steel balls so that they gather onto the area where more dust is deposited.

Heat pipe heat exchanger

A heat transfer tube comprising an inner tube formed of copper or steel, an intermediate layer having a uniform thickness, mounted on the outer periphery of the inner tube and formed of a low melting point metal such as solder, tin or lead and an outer tube of lead or lead alloy mounted on the intermediate layer on the inner tube and metallurgically bonded with the intermediate layer when the low melting point metal is melted.

Method of making heat transfer tube

An apparatus for heating fluid in a storage tank or transport pipe includes a elongated horizontally positioned tubular receiver having a cover plate at one end thereof through which an electric cartridge heater is inserted into a lower portion of the receiver. A vaporizable working fluid partially fills the lower portion of the receiver to a level sufficient to cover the heater and a temperature detector for controlling the heater is inserted through the cover plate into the receiver above the level of the fluid therein. A sealed tubular heat exchanger communicates with the receiver through a single passage through which vaporized working fluid enters the heat exchanger and condensed working fluid's returned to the receiver and the receiver and heat exchanger are evaculated of gasses. The heat exchanger may be disposed whithin a container holding fluid to be heated or constitute a jacket disposed around the container.

Electric fluid heating apparatus utilizing a vaporizable working fluid

A separate type heat exchanger characterized in that the evaporation section heated by the hot fluid is formed by fitting a plurality of the evaporation pipes horizontally between the vapor header pipe and the condensed liquid header pipe, the condensation section cooled by the cold fluid is formed above said evaporation section by fitting a plurality of the condensation pipes between the vapor header pipe and the condensed liquid header pipe, both vapor header pipes are connected through the vapor pipe and both condensed liquid header pipes are connected through the condensed liquid pipe to form a circulation path, and said path contains the working fluid is sealed within said path which circulates by evaporating at the evaporation section and condensing at the condensation section.

Growing community of inventors

Yokohama, Japan

Junji Sotani