The Furukawa Electric Co., Ltd.

Furukawa-Sky Aluminum Corporation

Uacj Corporation

Dai Nippon Printingco., Ltd.

Junji Ninomiya

Koichi Suzuki

Takahiro Okada

Hiroshi Yagi

Yoshikazu Suzuki

Kotaro Kitawaki

Takashi Murase

Yoshiyuki Oya

Yoshiaki Ogiwara

Takeshi Kihara

Tomohito Kurosaki

Toshiyuki Kakinoki

Akira Hideno

Nobuyuki Kakimoto

Kazunori Ishikawa

Kazumi Kato

Satoshi Tanaka

There is provided a heat exchanger and a fin material for the heat exchanger that can suppress occurrence of hollow corrosion in a fin and hold cooling performance for a long period of time under a high corrosion environment. The heat exchanger includes an aluminum tube through which a working fluid circulates and an aluminum fin which is bonded to the tube. The fin has a region B around a grain boundary, and a region A around the region B. In the region B, 5.0&#xd7;10pieces/mmless of Al&#x2014;Fe&#x2014;Mn&#x2014;Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 &#x3bc;m, are present. In the region A, 5.0&#xd7;10pieces/mmto 1.0&#xd7;10pieces/mmof Al&#x2014;Fe&#x2014;Mn&#x2014;Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 &#x3bc;m, are present.

Heat exchanger, and fin material for said heat exchanger

A structure of a microreactor includes a joined body having a pair of substrates joined together, a flow path formed by a microchannel portion formed on a joining surface of at least one of the substrates, and a catalyst carrying member disposed in the flow path. In the production of such a microreactor, the catalyst carrying member is produced separately from formation of the joined body and the catalyst carrying member is disposed in the flow path at the time of forming the joined body.

Micro-reactor and method of manufacturing the same

A heat exchanger which has i) a fin material comprising a triple-layer clad material constituted of a core material composed of an aluminum alloy containing from 0.5 to 1.8% by weight of Mn and from 0.5 to 3.0% by weight of Zn and, provided on both sides of the core material, a brazing filler material composed of an Al&#x2014;Si alloy containing from 6.5 to 13.0% by weight of Si and from 0.15 to 0.60% by weight of Cu and ii) an aluminum alloy tube having a Zn concentrated surface; the both having been brazed with each other; wherein, after brazing, recrystallized grains of the core material have an average length of from 100 to 1,000 &#x3bc;m in the lengthwise section of a fin and the recrystallized grains of the core material are 4 or less in average number in the thickness direction of that lengthwise section. This heat exchanger is improved in the durability of fin joints and fins themselves and their strength after corrosion.

Heat exchanger and fin material for the heat exchanger

A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.

Composite substrate for heat-generating semiconductor device and

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Tokyo, Japan

Junji Ninomiya