Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Junji Nakanishi

Toshio Saruyama

Yoshitsugu Morita

Katsutoshi Mine

Atsushi Togashi

Makoto Yoshitake

Minoru Isshiki

Kimio Yamakawa

Tomoko Kato

Kazumi Nakayoshi

Hiroki Ishikawa

Ken Tanaka

Ryoto Shima

Hiroji Enami

Yoshitsuga Morita

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein said curable liquid silicone composition has viscosity of 90 Pa&#xb7;s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf&#xb7;cm is not less than 1 min., while the time interval during which the torque grows from 1 kgf&#xb7;cm to 5 kgf&#xb7;cm is not more than 1 min.

Semiconductor device and method of manufacturing thereof

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule &lcub;alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)&rcub;; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition

A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.

Paste dispensing container

There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising (A) 100 weight parts of a curable resin; and (B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula

Epoxy group-containing silicone resin and compositions based thereon

The thermosetting silicone composition of the instant invention is comprised of (a) a diorganopolysiloxane containing alkenyl groups, (b) an organohydrogenpolysiloxane, (c) a platinum catalyst-containing silicone resin fine particle catalyst comprised of (i) a thermoplastic silicone resin containing 5 to 90 mole % PhSiO.sub.3/2 siloxane units and 5 to 20 mole % MeViSiO.sub.2/2 siloxane units, wherein Ph denotes phenyl, Me denotes methyl and Vi denotes vinyl; said resin having a glass transition point of 40.degree. to 70.degree. C. and (ii) 0.05 to 2 wt % as platinum atoms of a platinum catalyst; and (d) a hydrosilation reaction inhibiting compound. The thermosetting silicone compositions have excellent storage stability at about room temperature, and cure at a fast rate when heated.

Thermosetting silicone composition

A microparticle catalyst for hydrosilylation reactions which contains microparticles of an average particle diameter of 0.1 to 20 .mu.m made of a metallic catalyst for hydrosilylation reactions; a disiloxane having the general formula (R.sup.1 R.sup.2 ArSi).sub.2 O, wherein, R.sup.1 is an alkenyl group, R.sup.2 is a monovalent hydrocarbon group and Ar is an aryl group; and a resin having a glass transition temperature of 40.degree. to 200.degree. C. and thermosetting silicone composition containing the microparticle catalyst.

Microparticle catalysts for hydrosilylation reactions and thermosetting

The present invention relates to a hardenable organopolysiloxane composition having a viscosity of less than 30,000 Poise at 25.degree. C. comprising (A) 30 to 75 wt % of a silicone resin, (B) 70 to 25 wt % of a mercapto functional organopolysiloxane, (C) 0.1 to 10 parts by weight per 100 parts by weight of (A)+(B) of a mercapto functional organosilane, and (D) 0.01 to 10 parts by weight per 100 parts by weight of (A)+(B) of a condensation catalyst. The present invention also relates to an article of manufacture obtained by applying the hardenable organopolysiloxane composition to a substrate, exposing the composition and substrate to high energy radiation, and then applying a solid support to the coated substrate.

Hardenable organopolysiloxane compositions

A curable organopolysiloxane composition that maintains flowability under moisture-free and light blocking conditions, more rapidly forms a nonflowable adhesive when irradiated with high energy beams such as ultraviolet rays and electron beams, and forms an elastic body by further curing when exposed to atmospheric moisture. It also involves a method for adhering a substrate to an adherend using the composition. The curable organosiloxane composition has a viscosity of 3,000 Pa.s or less and is made up of a silicone resin containing no alkenyl groups, a polydiorganosiloxane having terminal units containing a mercapto group, an alkenyl-containing organopolysiloxane, and a condensation-reaction-promoting catalyst. An assembly which has a substrates adhered to an adherend is made by spreading the composition on the substrate, irradiating it with a high energy beam, contacting the irradiated surface with an adherend, and letting it stand in air, so that the substrate is adhered to the adherend.

Curable organopolysiloxane composition and method for adhering a

There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising

The invention provides a method for manufacturing an alkoxy radical-containing silicone resin wherein the molecular weight, viscosity, thermal transition point, and alkoxy radical content can be easily controlled. The method of the instant invention comprises combining under anhydrous conditions, (A) an alkoxysilane represented by the formula R.sup.4.sub.a Si(OR.sup.5).sub.4-a or its partial hydrolysis product wherein R.sup.4 is selected consisting of a monovalent hydrocarbon radical and a monovalent halogenated hydrocarbon radical, R.sup.5 is selected from the group consisting of an alkyl radical containing 1 to 6 carbon atoms, and a has a value of 0 to 3; and (B) an organopolysiloxane or a mixture of organopolysiloxanes selected from the group consisting of organopolysiloxanes that are made of siloxane units selected from the group consisting of R.sup.1 SiO3.sub./2 and R.sup.2 R.sup.3 SiO and mixtures thereof wherein R.sup.1, R.sup.2 and R.sup.3 are independently selected from the group consisting of monovalent hydrocarbon radicals and monovalent halogenated hydrocarbon radicals; followed by heating the mixture of (A) and (B) in the presence of a basic catalyst to perform a reequilibration reaction for said components (A) and (B).

Manufactured method of alkoxy radical-containing silicone resin

Silicone resins containing monorganosiloxane and diorganosiloxane units and exhibiting reproducible values of molecular weight and dispersity are prepared by condensing a mixture of hydrolyzed silanes, adjusting the solids content of the condensed resin and then subjecting the resultant product to a re-equilibration reaction in the presence of an alkali metal compound.

Growing community of inventors

Chiba Prefecture, Japan

Junji Nakanishi