C.uyemura Co., Ltd.

Junji Mizumoto

Masayuki Utsumi

Hisamitsu Yamamoto

Syunsaku Hoshi

Fujio Asa

Teruyuki Hotta

Takahiro Ishizaki

Takuya Okamachi

A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrateis sandwiched and held by a clipof a hanger. A pipeas a treatment solution releasing section is provided on each side of the substratethat is held by the hanger. This pipeis provided with a holefrom which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate, reaches a lower portion thereof, is circulated by a pump, and is released from the pipeagain.

Surface treating apparatus

To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tankincludes an upper guide railthat is provided above the plating tankand transports a transport hangerin a moving direction and a lower guide railthat is provided inside the plating tankand generates an attractive force against a lower clampof the transport hanger. In the plating tank, an attractive force is generated while performing plate processing to pull the lower clampof the transport hangerdownward, thereby giving tension to a plate-like work W.

Surface treating apparatus and plating tank

An tank such as an electroless copper plating tank, includes a liquid squirting parthaving a squirt portfor squirting the processing solution Q from the squirt porttoward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like workso that the processing solution Q runs down the plate-like work

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Osaka, Japan

Junji Mizumoto