Ebara Corporation

Other

Kabushiki Kaisha Toshiba

International Business Machines Corporation

Hirata Corporation

Junji Kunisawa

Mitsuru Miyazaki

Natsuki Makino

Norio Kimura

Fujihiko Toyomasu

Koji Mishima

Kenichi Kobayashi

Naoki Matsuda

Seiji Katsuoka

Kenji Nakamura

Hiroaki Inoue

Hiroshi Sotozaki

Shinya Morisawa

Katsuya Okumura

Osamu Nabeya

Hiroyuki Shinozaki

Takahiro Ogawa

Teruaki Hombo

Hisashi Kaneko

Tetsuo Matsuda

Toshio Yokoyama

Hisajiro Nakano

Akira Imamura

Mitsuko Odagaki

Hiroyuki Yano

Mitsuhiko Shirakashi

You Ishii

Naoki Toyomura

Moriji Matsumoto

Toshiyuki Morita

Kunihito Ide

Nobuo Hayasaka

Koji Maeda

Manabu Tsujimura

Toru Maruyama

Hiroyuki Kanda

Masahiko Sekimoto

Satoru Yamamoto

Manao Hoshina

Teruyuki Watanabe

Masayuki Kumekawa

Keiichi Kurashina

Masayoshi Imai

Takahiro Nanjo

Hariklia Deligianni

Hiroshi Tomita

Kenichi Suzuki

Emanuel Israel Cooper

Kenya Ito

Tsutomu Karimata

Takashi Kawakami

Katsuhide Watanabe

Keisuke Namiki

Mizuki Nagai

Akira Fukunaga

Kuniaki Yamaguchi

Yusuke Watanabe

Soichi Nadahara

Hideo Aizawa

Tsutomu Nakada

Kenichiro Saito

Motoyuki Sato

Hiroshi Aono

Hidenao Suzuki

Philippe M Vereecken

Hiroshi Shimomoto

Koichi Hashimoto

Mitsuhiko Inaba

Brett Caroline Baker-O'Neal

Kenji Shinkai

Hidetatsu Isokawa

Takeshi Iizumi

Katsuhiko Tokushige

Yohei Eto

Tetsuya Yashima

Suguru Ogura

Michiaki Matsuda

Keiji Kanazawa

Fuyuki Ogaki

Shunsuke Matsuzawa

Yoshitaka Kitagawa

Katsuyuki Musaka

Yuuki Inoue

Lien Yin Cheng

The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles. A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.

Chemical supply apparatus, cleaning system, and chemical supply method

To improve liquid draining of a liquid supplying device. A method for draining a liquid of a pipe of a liquid supplying device including a step for drying an inside of the pipe by circulating an inert gas in the pipe without dividing the pipe, wherein the step for drying includes a step for protecting a pressure sensor from static electricity, through a pressure sensor that has a sensor covered portion electrically connected with a housing of the liquid supplying device, the sensor covered portion is exposed to the inside of the pipe or exposed to a flow path communicating with the inside of the pipe.

Liquid supplying device and method for draining liquid thereof

There is provided an apparatus for supplying liquid, comprising a flow controller configured to measure a flow rate of a liquid and control the flow rate based on a measurement value; a first valve connected with the flow controller to control supply of a first liquid to the flow controller; a second valve connected with the flow controller to control supply of a second liquid to the flow controller; and a control device configured to control the first valve and the second valve, wherein the control device switches over the first valve and the second valve with providing a delay time between an open/closed switchover time of the first valve and an open/closed switchover time of the second valve.

Apparatus for supplying liquid, cleaning unit, and apparatus for processing substrate

A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

Jig and installation method using same jig

The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system () includes an exhaust damper (), a first pressure sensor (), and a controller () configured to control an opening degree of the exhaust damper (). The controller () is configured to switch the opening degree of the exhaust damper () to an opening degree smaller than a full opening on condition that a shutter () is opened.

Damper control system and damper control method

A cleaning chemical liquid supply device includes: first and second mixers respectively mixing first chemical liquid with dilution water and respectively supplying to first and second nozzles respectively supplying the first chemical liquid adjusted to desired flow rates and concentrations to a first position and a second, different position of the substrate in the cleaning device; a first dilution water control box controlling flow rates of the dilution water supplied to the first and second mixers; third and fourth mixers respectively mixing second, different chemical liquid with the dilution water and respectively supplying to third and fourth nozzles for respectively supplying the second chemical liquid adjusted to desired flow rates and concentrations to a third position and a fourth, different position of the substrate in the cleaning device; and a second dilution water control box controlling flow rates of the dilution water supplied to the third and fourth mixers.

Cleaning chemical liquid supply device and cleaning chemical liquid supply method

A cleaning device includes: a plurality of rollers that hold a peripheral edge part of a substrate; a rotation driving unit that rotates the substrate by rotationally driving the plurality of rollers; a cleaning member that abuts on the substrate and cleans the substrate; a cleaning liquid supply nozzle that supplies a cleaning liquid to the substrate; a microphone that detects a sound generated when a notch of the peripheral edge part of the substrate hits the plurality of rollers; and a rotation speed calculation unit that calculates a rotation speed of the substrate on the basis of the sound detected by the microphone.

Cleaning device, polishing device, and device and method for calculating rotation speed of substrate in cleaning device

A substrate cleaning apparatus and related apparatuses/methods are disclosed. In one embodiment, a substrate cleaning apparatus includes: a first spindle group including a first driving spindle having a first driving roller configured to rotate a substrate and an idler spindle having a driven roller rotated by the substrate; a second spindle group including a plurality of second driving spindles each having a second driving roller configured to rotate the substrate; a cleaning mechanism configured to clean the substrate rotated by the first driving roller and the plurality of second driving rollers; and a rotation detector configured to detect the rotational speed of the driven roller. The driven roller is positioned on the opposite side to a direction in which the substrate receives a force from the cleaning mechanism.

Substrate cleaning apparatus, substrate processing apparatus, and method of cleaning substrate

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.

Carrier device, work processing apparatus, control method of carrier device and storage medium storing program

In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

Buff processing device and substrate processing device

A cleaning apparatus includes a plurality of processing units including a cleaning unit which cleans a processing object, a transport chamber provided between the plurality of processing units, a transport robot provided inside the transport chamber so as to be movable vertically, an exhaust port portion which discharges gas compressed, when the transport robot descends, from a lower portion of the transport chamber, and a liquid remaining unit which causes liquid transported to the compressed gas to remain in the lower portion of the transport chamber.

Cleaning apparatus and substrate processing apparatus

The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

Liquid supplying device and liquid supplying method

Provided is a wet substrate processing apparatus for processing a substrate. The apparatus comprises a table for holding a substrate, and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table. The table includes a support face for supporting the substrate, a first opening formed in the support face, a second opening formed in the support face and arranged at least partially around the first opening, a first fluid path configured to extend to the first opening of the support face via the table and be connectable to a vacuum source, and a second fluid path configured to extend to the second opening of the support face via the table and discharge the process liquid.

Table for holding workpiece and processing apparatus with the table

Growing community of inventors

Tokyo, Japan

Junji Kunisawa