Tdk Corporation

Junji Aotani

Shigeaki Tanaka

Tetsushi Inoue

Tatsuo Namikawa

Katsuyuki Kurachi

Yuuki Aburakawa

Tetsuji Fujita

Hiroyuki Endo

Yoshihiko Yano

Yasunobu Oikawa

An electronic device sheet, comprising a pair of electrodes, a dielectric layer provided between the pair of electrodes, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein the insulation patch member includes a boundary line having an undulating shape.

Electronic device sheet

The electronic device sheet comprises a pair of electrode layers, a dielectric layer provided between the pair of electrode layers, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein the number of the insulation patch members is 1 or more and 1000 or less per 1 cmof the principal surface, and the total area of the insulation patch members is 10 &#x3bc;mor larger and 3 mmor smaller per 1 cmof the principal surface.

Electronic device sheet having insulation patch member on dielectric layer

A thin film capacitor comprises: a laminated body that has a base electrode, a dielectric layer and an upper electrode layer; a protective layer covering the base electrode, the dielectric layer and the upper electrode layer, and includes a first through-hole that reaches the base electrode, and a second through-hole that reaches the upper electrode layer; a first extraction electrode in the first through-hole and electrically connected with the base electrode; a second extraction electrode in the second through-hole and electrically connected with the upper electrode layer; a first terminal electrode on the protective layer, and connected with the base electrode through the first extraction electrode; and a second terminal electrode on the protective layer, and connected with the upper electrode layer through the second extraction electrode. Young's modulus of the protective layer is equal to or higher than 0.1 GPa and equal to or lower than 2.0 GPa.

Thin film capacitor

A thin film capacitor includes a lower electrode layer, an upper electrode layer, and a dielectric substance layer provided between the lower electrode layer and the upper electrode layer. A dielectric patch member formed of a dielectric material is formed on a surface of the dielectric substance layer on an upper electrode layer side, a cross-sectional structure of the dielectric patch member has a taper angle of 1 to 25 degrees in a cross section perpendicular to the dielectric substance layer, the taper angle being an angle formed by (1) a tangential line tangent to an end portion of the dielectric patch member at a position that is 50% of a maximum height of the dielectric patch member and (2) a line being an interface between the dielectric substance layer and the upper electrode layer, and an area of the dielectric patch member is 100 to 900000 &#x3bc;m.

Thin film capacitor with improved resistance to dielectric breakdown

A thin film capacitor includes a pair of electrode layers, a dielectric layer existing between the pair of electrode layers, and a ceramic layer disposed on a surface opposite to the dielectric layer of at least one of the electrode layers.

A thin film capacitor including a lower electrode layer, a dielectric layer provided on the lower electrode layer, and an upper electrode layer formed on the dielectric layer, wherein the dielectric layer includes a recessed portion in a portion on the upper face thereof, a cross-sectional structure perpendicular to the dielectric layer of the recessed portion has a cross-sectional taper angle of 1 degree or more and 25 degrees or less, and the distance between the bottom portion center and an outermost portion of the recessed portion is 20 times or more and 150 times or less a thickness of the dielectric layer.

A thin film capacitor is provided with a lower electrode layer, a dielectric layer arranged on the lower electrode layer, and an upper electrode layer formed on the dielectric layer. An insulator patch material, circular when projected from above, is formed at a boundary of the dielectric layer and the upper electrode layer of the thin film capacitor of this invention. The circular insulator patch improves a withstand voltage, by reducing accumulation of charges.

An organic EL device comprising organic compound layers, at least one of which has a skeleton represented by formula (I): where Lis any one of o-, p-, and m-phenylene groups which have two, three or four rings and which may have a substituent with the proviso that when Lis a phenylene group having four rings, the phenylene group may have an unsubstituted or substituted aminophenyl group somewhere therein, R, R, Rand Rare each any one of the following groups: where R, R, R, R, R, Rand Rare each a substituted or unsubstituted aryl group, and r, r, rand rare each an integer of 0 to 5 with the proviso that r+r+r+r1, is less susceptible to physical changes, photochemical changes and electrochemical changes, and can emit light having various colors with high reliability and high light emission efficiency.

Growing community of inventors

Tokyo, Japan

Junji Aotani