Nhk Spring Co., Ltd.

Fujitsu Corporation

Junichi Yano

Akira Tange

Mamoru Akeda

Naoshi Sato

Takehisa Sugahara

Noritoshi Sakaide

Isamu Okuyama

Toyokatu Nakagawa

A silencer for a leaf spring assembly. The silencer is disposed between end portions of leaf springs. The silencer has a two-layer structure which has a fixing layer and a sliding layer which are integrally formed. The fixing layer has a projection portion, and the projection portion has an engagement portion at a leading end portion thereof. The fixing layer, which is fixed at the fixing side leaf spring, has a tensile strength higher than the sliding layer. The sliding layer, which abuts the sliding side leaf spring, has a hardness lower than the fixing layer. The projection portion of the fixing layer can have sufficient strength to resist the shearing force. In the sliding layer, undesirable noise generation is difficult, and even when a load transmission portion of an end portion of the sliding side leaf spring partially abuts the sliding layer, undesirable noise generation can be prevented.

Silencer for a multi-leaf spring

Leaf springs have improved durability in spite of using inexpensive spring steel such as SUP9 and SUP11 as materials. While a spring main body, made of the spring steel in which Brinell hardness is under 555 HBW and not less than 388 HBW (corresponding to a diameter of under 2.70 mm of hardness and not less than 3.10mm of hardness on a Brinell ball mark), is maintained at 150 to 400&#xb0; C., the load is applied in the direction in which the spring main body is to be used, and the first shotpeening is performed at the plane where the tensile stress acts.

Method for manufacturing a leaf spring

A semiconductor device comprising: a semiconductor chip; a package for accommodating the chip; groups of leads which are arranged around the perimeter of the package; and strip; insulators, such as plastic films, to each of which one of the groups of leads are adhered. In addition, a method for manufacturing the device, comprising the steps of: preparing a package including a semiconductor chip and having lead frames each of which is composed of leads and a supporting end portion; adhering the lead frames to an insulating sheet such as a plastic film; and clipping off the portions of the insulating sheet to which the supporting end portions are adhered.

Method for manufacturing semiconductor device with leads adhered to

Growing community of inventors

Yokohama, Japan

Junichi Yano