Sony Semiconductor Solutions Corporation

Sony Corporation

Junichi Tokunaga

Yuuji Kishigami

Yoshihiro Nabe

Seiya Tsuzaki

Noboru Kawabata

To simplify mounting of a component near a shield cover in an image-capturing apparatus. An image-capturing apparatus includes an imaging device, a substrate, a drive circuit, a lens unit, an adhesive, and a shield cover. The imaging device is arranged on the substrate. The drive circuit is arranged on the substrate to be adjacent to the imaging device. The lens unit includes a lens and a frame-shaped rib, the lens forming an image of a subject into the imaging device, the rib being arranged in a bottom portion of the lens unit and surrounding the imaging device, the lens unit being arranged by the rib being placed on the substrate. The adhesive has a photo-curable property and bonds the lens unit to the substrate. The shield cover includes a light path used when the adhesive is cured and covers the drive circuit.

Image-capturing apparatus and method for producing image-capturing apparatus

To improve strength of an imaging module with an adjusted optical axis. An imaging device includes an imaging module and a holding unit. The imaging module provided in the imaging device includes an imaging element that images incident light introduced from an upper surface of a housing. The holding unit provided in the imaging device surrounds and holds a side surface of the imaging module, the side surface being adjacent to the upper surface of the housing. The holding unit surrounds and holds the side surface of the imaging module, thereby protecting the imaging module.

Imaging device and method of manufacturing imaging device

The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.

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Kumamoto, Japan

Junichi Tokunaga