Matsushita Electric Industrial Co., Ltd.

Junichi Terayama

Kiyoshi Arita

Tetsuhiro Iwai

Tadafumi Shimizu

Hidehiko Inokuchi

Hiroyuki Noda

Tetsuya Mitsuyasu

In a plasma treating apparatus for carrying out a plasma treatment over a silicon waferhaving a protective tapestuck to a circuit formation face, the silicon waferis mounted on a mounting surfacewhich is provided on an upper surface of a lower electrodeformed of a conductive metal with the protective tapeturned toward the mounting surface. When a DC voltage is to be applied to the lower electrodeby a DC power portionfor electrostatic adsorption to adsorb and hold the silicon waferonto the lower electrodein the plasma treatment, the protective tapeis utilized as a dielectric for the electrostatic adsorption. Consequently, the dielectric can be thinned as much as possible and the silicon wafercan be held by a sufficient electrostatic holding force.

Plasma treating apparatus and plasma treating method

A fixing roller cooperates with a pressing roller to heat and press a toner image to a recording medium so as to fix the toner image to the recording medium. A sheet-like web is impregnated with a mold release for supplying the mold release to a surface of the fixing roller by being pressed by the pressing roller. A first shaft has an unused portion of the web wound therearound, and a second shaft takes up the web after supplying the mold release to the fixing roller. A coil spring applies a rotational force in a direction opposite to a direction of drawing out the web relative to the first shaft so as to apply a tension to the web, thereby automatically removing slackness of the web.

Fixing apparatus and image forming apparatus provided with the same

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Tosu, Japan

Junichi Terayama