Daikin Industries, Ltd.

Science and Technology Agency

Dakin Industries, Ltd.

Junichi Teraki

Akihiko Oguri

Masanobu Kita

Nobuki Matsui

Tomohiro Yabu

Shuji Ikegami

Hiroshi Doumae

Motonobu Ikeda

Masahide Fujiwara

Mitsuhiro Tanaka

Michio Moriwaki

Hirofumi Nishibayashi

Masayuki Niino

Noriyuki Okuda

Satoshi Ishida

Takayuki Setoguchi

Akio Yoshimoto

Tohru Hirano

Shogi Kawachi

A solid-state refrigeration apparatus includes a solid cooling structure, first and second heat exchangers, a heating medium circuit, a reciprocating conveying mechanism, and a thermal storage section. The solid cooling portion includes a solid refrigerant substance, an internal channel where the solid refrigerant substance is disposed, and an induction section configured to cause the solid refrigerant substance to produce a caloric effect. The heating medium circuit is connected to the first and second heat exchangers, and the internal channel. The heating medium heated by the solid cooling portion dissipates heat in the first heat exchanger and the heating medium cooled by the solid cooling portion absorbs heat in the second heat exchanger a heat application operation. Frost on the second heat exchanger is melted using the heat stored in the thermal storage section in a defrosting operation. The thermal storage section stores heat in the heat application operation.

Solid-state refrigeration apparatus

A solid-state cooling module includes a plurality of housing portions. Each of the housing portions houses a solid refrigerant substance. The solid-state cooling module is configured to heat or cool a heat medium flowing through insides of the plurality of housing portions. At least some of the plurality of housing portions are connected to each other in series with respect to a flow of the heat medium.

Solid-state cooling module

A magnetic refrigeration module includes a housing, low and high temperature inflow paths, low and high temperature outflow paths, and first and second intermediate flow paths. The housing houses a magnetic working substance, and forms a flow path. The low and high temperature inflow paths carry heating medium into first and second ends of the flow path. First and second spaces are formed between the first and second ends and the low and high temperature inflow paths. The low and high temperature outflow paths receive the heating medium from the first and second ends of the flow path. The first and second intermediate flow paths communicate with the low and high temperature inflow paths and the first and second spaces. The first and second intermediate flow paths expand heating medium flow from the low and high temperature inflow paths to the first and second spaces.

Magnetic refrigeration module

A heat exchange system includes an outdoor heat exchanger, an indoor heat exchanger, a compressor, an expansion valve, a capillary tube, and a cooling jacket. The compressor is provided on a first path that is one of two paths connecting the outdoor heat exchanger and the indoor heat exchanger, and the expansion valve, the capillary tube and a check valve are provided on a second path of the two paths connecting the outdoor heat exchanger and the indoor heat exchanger that is opposite to the path on which the compressor is provided. The cooling jacket for cooling an object to be cooled is provided between the expansion valve and the capillary tube.

Heat exchange system with fixed and variable expansion devices in series

A cooler is placed on a power module to cool the power module with refrigerant through a refrigerant pipe, and includes a heat transfer plate having a groove into which a cooling pipe is fitted, and a presser plate configured to press the cooling pipe against the groove. The cooler includes a hinge mechanism configured to rotatably attach the presser plate to the heat transfer plate such that the presser plate is switched between an open position at which the groove is exposed and a closed position at which the presser plate covers the groove.

Cooler, electrical component unit, and refrigeration apparatus

A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe.

Cooling member with pressed pipe

A refrigerant pipe attachment structure is provided, in which it can be ensured that a refrigerant pipe is held and thermal resistance between the refrigerant pipe and a heat transfer member can be sufficiently reduced. A heat transfer member formed with an elongated groove into which a refrigerant pipe is fitted and thermally contacting a cooling target is provided. An elastic member formed in an elongated plate shape extending along an extension direction of the refrigerant pipe and including a pipe-facing part facing the refrigerant pipe is provided. A pressing mechanism configured to press the elastic member toward the heat transfer member is provided.

Refrigerant pipe attachment structure

A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.

Refrigerating apparatus

In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.

Refrigeration apparatus

A facing surface of a refrigerant jacket includes a contact portion which contacts a device main body, a first recessed portion which faces a first lead section and secures an insulation distance to the first lead section due to being positioned further away from a power device than the contact portion, and a second recessed portion which faces the second lead section and secures an insulation distance to the second lead section due to being positioned further away from the power device than the contact portion.

A cooler includes a circular pipe member through which a heating medium circulates, and being in thermal contact with a power module to cool the power module with the heating medium flowing through an interior of the circular pipe member. An axially extending channel formation member between which and an inner circumferential surface of the circular pipe member a narrow channel for the heating medium is formed is provided in the circular pipe member.

Cooler and refrigerating apparatus including the same

A thermoelectric device including a first insulating substrate (A) and a second insulating substrate (B) stacked on each other. Including a first electrode () formed on the upper surface of the first insulating substrate (A), a pair of second electrodes () individually formed on opposite surfaces thereof and connected to each other via a through-hole (), and a thermoelectric material () provided in the form of a thin film so as to contact the first electrode () and the second electrode (). Furthermore, including a pair of third electrodes () formed on opposite surfaces of the second insulating substrate (B) and connected to each other via a through-hole () while one of the third electrodes () is connected to the first electrode ().

Thermoelectric device

An air conditioning apparatus is provided which includes a plurality of heat exchangers () for effecting heat exchange between a heating medium (such as refrigerant, cold and hot water et cetera) and air and which is adapted to separately perform sensible heat processing and latent heat processing of room air (RA). In the air conditioning apparatus, at least one heat exchanger () is made up of an adsorption heat exchanger () that supports on its surface an adsorbent, thereby preventing the increase in apparatus size and making it possible to perform operations at high COP.

Air conditioning apparatus

A refrigerant circuit () is provided with two adsorption heat exchangers () in addition to an outdoor heat exchanger () and an indoor heat exchanger (). An adsorbent is carried on the surface of each of the adsorption heat exchangers (). In the adsorption heat exchanger () serving as an evaporator, moisture in the air is adsorbed by the adsorbent. In the adsorption heat exchanger () serving as a condenser, moisture is desorbed from the adsorbent and then applied to the air. Then, the air dehumidified or humidified by the adsorption heat exchanger () is supplied to a room to cope with latent heat load in the room. On the other hand, in the indoor heat exchanger (), air is cooled or heated. Then, the air cooled or heated by the indoor heat exchanger () is supplied to the room to cope with sensible heat load in the room.

Air conditioning system

A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.

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Shiga, Japan

Junichi Teraki