Tokyo Electron Limited

Junichi Takei

Naoyuki Suzuki

Tetsuya Miyashita

Hiroshi Sone

Tatsuo Hatano

Shinji Furukawa

Hiroyuki Toshima

Shinji Orimoto

There is provided a film forming apparatus comprising a processing chamber including a processing chamber main body and a lid, a stage, a target, and a shield. The shield has a chamber shield fixed to the processing chamber main body and a target shield fixed to the lid. The chamber shield has a cylindrical sidewall and a horizontal wall formed at a radially outer side of the cylindrical sidewall. The target shield has a cylindrical portion extending toward the stage. A diameter of an outer peripheral surface of the cylindrical portion is smaller than a diameter of an inner peripheral surface of the cylindrical sidewall, and the cylindrical portion and the cylindrical sidewall form a double pipe structure in which the cylindrical portion and the cylindrical sidewall overlap at least partially in a height direction.

Film forming apparatus

A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.

Sputtering device

A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.

Film-forming device

A sputtering apparatus includes: a target disposed on a ceiling of a processing container capable of being depressurized; a gas inlet configured to supply a sputtering gas into the processing container; a first shield disposed around the target and configured to prevent deposition of a film around the target; and a second shield disposed in the processing container to cover an inner wall of the ceiling with a space from the ceiling, and including an opening in a portion corresponding to the target.

Sputtering apparatus

A film forming apparatus includes: a chamber main body defining a chamber; a slit plate partitioning the chamber into a first space and a second space below the first space, the slit plate having a slit penetrating therethrough; a holder holding a target in the first space; a stage for supporting a substrate, the stage being movable in a moving direction perpendicular to a longitudinal direction of the slit in a moving area including an area directly below the slit; and a mechanism for moving the stage along the moving direction. In order to suppress scattering of particles from the target to another area other than the moving area in the second space through the slit, the stage has one or more protruding portions which provide upwardly and/or downwardly bent portions in a path around the stage between the slit and the another area in the second space.

Growing community of inventors

Yamanashi, Japan

Junichi Takei