Hitachi, Ltd.

Other

Hitachi Ulsi Systems Co., Ltd.

Hitachi Tokyo Electronics Co., Ltd.

Junichi Suzuki

Ryosuke Kimoto

Kosuke Inoue

Takamichi Suzuki

Tatsuya Yoneda

Hideki Nagatsuka

Tatsuo Goto

Tadao Inoyama

Kiyoo Takeyasu

Hiroshi Ishimura

In a CRT operation system for operation and monitoring of plant equipment in a plant worksite through a central control room and a network, an operation control personal computer is provided for monitoring and operating the plant equipment, and one or more wireless LAN transceivers or transmitting/receiving sections are provided to appropriate points in a patrol route around the plant equipment, for wireless communication with the operation control personal computer. The personal computer controls the plant equipment through a wireless transceiver and a network, and transmits therethrough information signals of on-site operation of the plant equipment to enable a display device and a sound/voice output device provided in the central control room.

Plant operating apparatus and method

An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arranged consecutively on a first tape; and the aggregate also includes a second tape, which is a spacer tape, having spacers (protrusions), provided between adjacent windings of the first tape on the reel, providing spaces for the semiconductor packages. The semiconductor packages can be provided with bumps, e.g., on the side of the first tape opposite the side of the first tape having the semiconductor packages thereon, and the first tape can be a flexible printed circuit board.

Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers

A method for forming bumps in an LSI package in which: semiconductor chips are mounted onto a flexible printed circuit board; electrically conductive balls are temporarily fixed by using a fixing liquid including one selected from a group including flux, solder paste and an adhesive containing an electrically conductive agent, onto pads which are provided on the flexible printed circuit board so as to be electrically connected to the semiconductor chips; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is wound up onto a reel; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is fed out from the reel and heated to thereby form bumps thereon; and the flexible printed circuit board having the bumps formed thereon is wound up onto another reel; and the flexible printed circuit board is cleansed and trimmed to thereby form LSI packages.

Bump formation method

An automatic assembly control apparatus employs a holding mechanism for holding a collar with a hole, to which a shaft of a motor is inserted. The holding mechanism is coupled to a positioning mechanism through an elastic mechanism so that the positioning mechanism may be controlled in response to signals representative of the displacement or deflection of the elastic mechanism. The collar is first placed in rough upon the center axis of the shaft which has a step portion at the end portion thereof and then inserted onto the shaft while its position is corrected by the positioning mechanism. The insertion of the collar is stopped when it is caught at the step portion of the shaft and then the position of the collar is changed in such a manner that the collar is inserted onto the shaft over the step portion thereof. Then, the collar is gradually inserted onto the shaft.

Automatic assembly control method and apparatus therefore

Growing community of inventors

Ome, Japan

Junichi Suzuki