Tdk Corporation

Junichi Sutoh

Masayuki Yoshida

Shunji Aoki

Genichi Watanabe

Shinobu Fujiwara

Atsushi Satoh

Tetsuya Hattori

The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions

The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.

Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet

The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.

The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.

Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board

A high dielectric porcelain composition having, as a main component, a Pb(Mg 1/3, Nb 2/3)O.sub.3 -PbTiO.sub.3 -Pb(Mn 1/3, Nb 2/3)O.sub.3 system including 95 mol. % of Pb(Mg 1/3, Nb 2/3)O.sub.3, 5 mol. % of PbTiO.sub.3 and 0.5 weight % of Pb(Mn 1/3, Nb 2/3)O.sub.3, and, in addition, a sub-component including PbO and ZnO. Such a dielectric porcelain is capable of being sintered at a temperature lower than 1000.degree. C. A method of reducing the sintering temperature of such a high dielectric porcelain composition, is also provided.

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Tokyo, Japan

Junichi Sutoh