Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Junichi Sawanobori

Masao Kanari

Daoqiang Lu

Chunfu Chen

Xin Wang

Hongyu Wang

Victor Xinya Lu

Daniel Lu

The present invention relates to a photo-curable liquid optically clear adhesive composition, to a cured adhesive and an article produced therefrom, and to the use thereof.

Photo-curable liquid optically clear adhesive composition and the use thereof

An object of the present invention is to provide a liquid adhesive composition that, when cured, has a high degree of bond strength and exhibits a relatively constant storage modulus in a wide range of temperatures. A liquid adhesive composition containing (A) an acrylate-functional resin, (B) a hydroxyl-containing (meth)acrylate, and (C) a silicone resin, the acrylate-functional resin (A) having a weight average molecular weight (M) of 25,000 to 100,000 and a M/Mratio of 2 or less, and the silicone resin (C) having a weight average molecular weight (M) of 450 to 2,000 and a silanol content of 0.1 to 5 wt. %, based on the silicone resin (C).

Liquid adhesive composition, adhesive sheet, and adhesive bonding method

The present application relates to a resin composition and in particular to a light-curable resin composition. It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition. In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, and c) 0.2 to 10 wt % of a photo initiator.

Light curable resin composition

A liquid photo-curable adhesive composition comprising:

Liquid optically clear photo-curable adhesive

A process for binding a top substrate to a base substrate is disclosed, in which

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Kanagawa, Japan

Junichi Sawanobori