Shin-etsu Chemical Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Junichi Sawada

Yusuke Taguchi

Tsutomu Kashiwagi

Toshio Shiobara

Miyuki Wakao

Yoshihiro Kawada

Naofusa Miyagawa

Chie Sasaki

Kenji Hagiwara

Naosuke Taniguchi

Kazutoshi Tomiyoshi

Shoichi Osada

Masataka Nakanishi

Kenichi Kuboki

Toshiyuki Sutou

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):

Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof

A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same

The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof

An epoxy resin represented by the following formula (1)  wherein Rrepresents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; Rrepresents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; Rrepresents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R, R, R, k, or m present in the formula may be the same or different from each other.

Silicone-modified epoxy resin and composition and cured article thereof

There is disclosed a silicone rubber composition curable by a radial ray comprising, at least, (A) an organopolysiloxane shown by the following general formula (1), (B) a phenyl ester derivative having an acryl group, (C) a sensitizer sensitized by a radial ray, and (D) a photosensitive dye, wherein each R, R, and Rindependently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms; X represents the same or different monovalent organic group having an acryl group or a methacryl group. As a result, there is provided a silicone rubber composition capable of being cured by irradiation of a radial ray whereby showing excellent adhesion with various substrates, capable of forming a cured film, and capable of easily distinguishing whether it is cured or not by observing appearance when not irradiated with a radial ray.

Silicone rubber composition curable by radial ray

A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent.

Underfill composition and an optical semiconductor device

There is disclosed a silicone-modified adamantane derivative represented by the following general formula (1),  Wherein each Rindependently represents a hydrogen atom or methyl group; each R independently represents a methyl group or phenyl group; n represents an integer from 2 to 1,000; and k represents a number of 0 to 2. There can be a photo-radically curable resin composition by adopting a novel and specific silicone-modified adamantane derivative, which composition is cured by photoirradiation even at a lower intensity of illumination, thereby enabling to obtain a cured product exhibiting not only an excellent moisture resistance but also an excellent adhesiveness to various substrates.

Silicone-modified adamantane derivative, photo-radically curable resin composition, and method for preparing photo-radically curable resin composition

Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula(CH)Si(OR)(OH)O&#x2003;&#x2003;(1) 

Silicone resin composition for optical semiconductor devices and an optical semiconductor device

A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.

White heat-curable silicone resin composition and optoelectronic part case

A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR)(OR)wherein Rand Rare organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.

White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device

The present invention provides a silicone resin composition for an optical semiconductor device, comprising 

Silicone resin composition for optical semiconductor devices

A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.

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Annaka, Japan

Junichi Sawada