Nec Corporation

Fujikura Limited

Sumitomo Electric Industries, Limited

Hitachi Chemical Company, Ltd.

Hirose Electric Company, Ltd.

Nec C Orporation

Junichi Sasaki

Kazuhiko Kurata

Ichiro Hatakeyama

Masataka Itoh

Takanori Shimizu

Takashi Yoshikawa

Kunihiko Fujiwara

Akito Nishimura

Yukio Hayashi

Kazunori Miyoshi

Kenji Sasaki

Hiroshi Honmou

Hideo Kikuchi

Tomoyuki Hino

Hikaru Kouta

Mikio Oda

Ryosuke Kuribayashi

Isao Yoneda

Youichi Hashimoto

Hiroshi Masuda

Kaichiro Nakano

Yuzo Shimada

Kazuhito Saito

Sakae Kitajo

Tomoaki Kato

Yoichi Hashimoto

Ichiro Ogura

Shigeyuki Yanagimachi

Hisaya Takahashi

Shuji Suzuki

Naoki Kitamura

Kiyoshi Fukushima

Mitsuru Kurihara

Masao Kinoshita

Yoshinobu Kaneyama

Osamu Ibaragi

Seiji Suda

Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.

Optical connection structure between optical backplane and circuit substrate

A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.

Connector holder, optical-electrical converter with attached connector holder, optical connector fixing structure and connector holder assembly method

An optical module includes: an optical device mounting board including a first surface, a second surface on the reverse side, and a light transparent part allowing an emitted light traveling from the first surface to the second surface and a received light traveling in the opposite direction to pass through the transparent part; an optical device mounted on the first surface, which is a light emitting device or a light receiving device; a first terminal mounted on a surface except the first surface of the optical device mounting board; a wiring connecting a second terminal of a component mounted on the first surface including the optical device with the first terminal; and a transmission medium connector connecting a light transmission medium transmitting the emitted light traveling from the second surface to an outside of the optical module or the received light traveling in the opposite direction.

Mounting of optical device on mounting board to at least provide heat radiation

An optical backplane connector with a board removable (being possible to insert and remove) therein in the direction perpendicular to the backplane plate surface is arranged on a backplane having optical transmission paths. The optical backplane connector accommodates a photoelectric conversion module in such a manner the incident and exit light are perpendicular to the backplane and a transparent board with a photoelectric conversion element mounted thereon is perpendicular to the board and parallel to the backplane. The conduction between the electric contacts of the photoelectric conversion module and the inner electric contacts of the optical backplane connector is held by mechanical contact. At the end portion of the optical transmission path on the backplane, an optical connector having a 45' mirror and guide pins is mounted. The positioning operation is achieved by fitting the guide pins of the optical connector with the guide holes of the photoelectric conversion module.

Optical backplane connector, photoelectric conversion module and optical backplane

A mounting structure, in which semiconductor packageand heat sinkfor dissipating heat generated from semiconductor packageare mounted on mounting board. The rear surface of semiconductor packageis bonded to the front surface of mounting boardfacing the rear surface. Heat sinkis brought into contact with the rear surface of semiconductor packagevia through-oleformed on mounting board. Semiconductor packageand heat sinkare pressed to each other by the elastic force of clip

Structure for mounting semiconductor package

A semiconductor device has printed wiring board () where electric wiring () connected to LSI chip () and to planar optical element () is formed, and where optical waveguide () which transfers light inputted into planar optical element () and/or light outputted from planar optical element () is fixed. Planar optical element () is mounted in one end of small substrate (), and another end of small substrate () is connected to printed wiring board () by solder bump (). One end of small substrate () where planar optical element () is mounted is fixed to printed wiring board () by a fixing mechanism. Small substrate () has flexible section (), which is easily deformable compared with other portions of printed wiring board () and small substrate (), in at least a partial region between one end where planar optical element () is mounted and another end electrically connected to printed wiring board ().

Semiconductor device having optical signal input-output mechanism

An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.

Optical connection structure of optical backplane to circuit substrate

A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.

Photoelectric composite module and optical input/output device

An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.

Optical connector and optical module

An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.

Optical connector for coupling an optical fiber to a circuit board

An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

Growing community of inventors

Tokyo, Japan

Junichi Sasaki