Hitachi, Ltd.

Renesas Technology Corp.

Other

Junichi Saeki

Kunihiko Nishi

Isamu Yoshida

Makoto Kitano

Aizo Kaneda

Asao Nishimura

Akihiro Yaguchi

Sueo Kawai

Hiroshi Kikuchi

Kunihiro Tsubosaki

Takashi Yokoyama

Gen Murakami

Akio Hasebe

Hiroshi Hozoji

Takashi Yamazaki

Kazuyoshi Oshima

Masahiro Ichitani

Shozo Nakamura

Noriyuki Kinjo

Hiroyoshi Kokaku

Masatsugu Ogata

Masanori Segawa

Syuuji Eguchi

Ichiro Anjoh

Ichiro Anjo

Tetsuro Matsumoto

Tetsurou Matsumoto

Shigeharu Tsunoda

Shuji Eguchi

Nae Yoneda

Michiharu Honda

Kenichi Otsuka

Kazuhiro Sugino

Kazuya Ooji

Shingo Akasaka

Naotaka Tanaka

Tsutomu Kono

Ryo Haruta

Takeshi Terasaki

Toshiya Teramae

Hiroko Imanishi

Toshio Ogawa

Masachika Masuda

Shuichi Suzuki

Kazuji Yamada

Masao Mitani

Kazuhiro Suzuki

Naoya Kanda

Akihiro Tamba

Junichi Arita

Ritsuro Orihashi

Kunio Matsumoto

Tomio Yamada

Michifumi Kawai

Hideo Yamakura

Susumu Tsuzuku

Masaaki Takahashi

Makoto Ishii

Ikuo Kawaguchi

Hisashi Onari

Kazuo Yamazaki

Ichiro Miyano

Toshihiro Yasuhara

Noritaka Kamimura

Tooru Yoshida

Osami Kaneto

Yasuharu Ichinose

Masayoshi Aoki

Hiroi Oka

Atsusi Nakamura

Kouzi Koizumi

Kenichi Imura

Sugino Kazuhiro

Masahiro Gouda

Masakazu Ozawa

Takashi Nakagawa

A model creation portion having a obstacle in a space includes two creation portions, one is to separate them and another is to combine them which handles, as porous media, an obstacle in which narrow spaces are regularly arranged. A thermosets flow analysis portion includes two analysis portions to separate and combine them, each of them has a viscosity equation for thermosets. The space/obstacle separation analysis portion analyzes by combining the viscosity equation with conservation equations of mass, momentum and energy, and the space/obstacle combination analysis portion analyzes by combining the viscosity equation with a conservation equation directed to a shape simplified as porous media. Resin flow behavior is analyzed while data in an interface between two models is delivered to each other, to accurately predict filling behavior at the time of injecting resin of thermosets molded articles having the complex obstacles.

Support system, support method and support program of resin molded article

To regulate the passage structure of a foaming die and the injected amount of foaming material, the flow behavior of the foaming material is analyzed by obtaining a flow velocity and a pressure by inputting the density as a function, including the elapsed time from the passage through an injection port to the foaming die and the thickness, and substituting a calculated density in equations of continuity and motion. In the analysis, the viscosity of the foaming material is used as a function including a time term. The boundary and molding conditions are corrected when the calculation does not converge. The density and pressure distributions of the foaming material are determined when the calculation converges. When the density and pressure distributions depart from design tolerances, the foaming passage structure and foaming material injected amount are regulated by an analysis program that corrects the model form, physical property or molding condition.

Three-dimensional foam analysis method, product design aiding method using the analysis method, and recording medium recording these methods

A design support apparatus including: a flow analyzer for analyzing a flow of thermosetting resin injected into a resin filling cavity to mold a resin mold product made of the thermosetting resin, using a finite difference method or a finite element method; a residual strain calculator for calculating residual strain (or stress) of the thermosetting resin after heat shrinkage of the thermosetting resin injected into the resin filling cavity to mold the resin mold product; and a strength analyzer for analyzing strength of the resin mold product, using a finite element method. According to this arrangement, strength of the resin mold product made of the thermosetting resin can be predicted accurately.

Design support apparatus and method for supporting design of resin mold product

A small semiconductor package having two electrodes, which can be produced at reduced cost and which features high reliability. The package has a structure in which an anode and a cathode are arranged on one surface of a semiconductor chip, each electrode having a bump electrode for connecting the electrode to an external substrate. An insulating resin is provided on the surface of the semiconductor chip and on the surfaces of the bump electrodes, except at least for the connection portions to the external substrate.

Diode package having an anode and a cathode formed on one surface of a diode chip

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the 'Lead-On-Chip' or 'Chip-On-Lead' structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Semiconductor device

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Semiconductor devices and methods of making the devices

A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

Semiconductor device and lead frame therefor

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the &ldquo;Lead-On-Chip&rdquo; or &ldquo;Chip-On-Lead&rdquo; structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame

A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bond ed to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.

A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold structure.

Semiconductor device including an integrally molded lead frame

Growing community of inventors

Yokohama, Japan

Junichi Saeki