Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Junichi Okaue

Koji Nitta

Shoichiro Sakai

Yoshio Oka

Yasushi Mochida

Tadahiro Kaibuki

Kenji Takahashi

Hiroshi Ueda

Masamichi Yamamoto

Katsunari Mikage

Ryuta Ohsuka

A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

Flexible printed circuit board and method of manufacturing flexible printed circuit board

A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.

Flexible printed circuit board, method for producing connection body, and connection body

According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 &#x3bc;m.

Printed circuit board and method of manufacturing printed circuit board

A printed circuit board according to one aspect of the present invention includes an insulating layer having a through-hole, a conductive layer laminated on an inner circumferential surface of the through-hole, and metal plating layers laminated on a surface of the conductive layer facing opposite the insulating layer and laminated on both surfaces of the insulating layer, wherein an average thickness of the insulating layer is greater than or equal to 5 &#x3bc;m and less than or equal to 50 &#x3bc;m, wherein an average thickness of the metal plating layers is greater than or equal to 3 &#x3bc;m and less than or equal to 50 &#x3bc;m, wherein a hole diameter of the through-hole gradually increases from a first end of the through-hole at one surface of the insulating layer to a second end of the through-hole at another surface of the insulating layer, wherein the hole diameter of the through-hole at the first end is greater than or equal to 1.5 times, and less than or equal to 2.5 times, the average thickness of the metal plating layers, and wherein the hole diameter of the through-hole at the second end is greater than or equal to 1.1 times, and less than or equal to 2 times, the hole diameter of the through-hole at the first end thereof.

Growing community of inventors

Shiga, Japan

Junichi Okaue