Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Junichi Murai

Hiroshi Yoshida

Kenichi Hayashi

Masao Kikuchi

Hisashi Kawafuji

Junji Fujino

Yoshitaka Otsubo

Goro Izuta

It is possible to provide a semiconductor device which can be obtained at a high reliability by warping an insulating substrate stably into a convex shape while ensuring a close contact between a cooling member and the insulating substrate. The semiconductor device includes an insulating substrate, a semiconductor element disposed on a first surface of the insulating substrate, a case connected to the insulating substrate, and a resin filled inside the case. Assuming that the thickness of the insulating substrate is denoted by t1, the thickness of the resin is denoted by t2, the linear expansion coefficient of the insulating substrate is denoted by &#x3b1;1, and the linear expansion coefficient of the resin is denoted by &#x3b1;2, the relationship therebetween satisfies t2&#x2267;t1 and &#x3b1;2&#x2267;&#x3b1;1, and a second surface of the insulating substrate opposite to the first surface thereof is warped into a convex shape.

Semiconductor device and manufacturing method thereof

In a semiconductor device (), semiconductor elements () and () are mounted on a lead frame () having leads (). The semiconductor elements () and () are connected with the leads () by metallic wires () and (). The semiconductor device () also has a heat sink (). The members () to () are sealed with a plastic package (). The leads () are exposed outward. Each of the end leads () to () has a wide first lead portion, a narrow second lead portion, a third lead portion to be inserted into an external substrate, and a protruding gap-controlling portion () for keeping the gap between the semiconductor device () and the external substrate constant. Because the heat resistance from the leads () to the plastic package () increases, the temperature-rise property of the lead is improved so that the solderability is improved.

Semiconductor device and semiconductor assembly module with a gap-controlling lead structure

Growing community of inventors

Tokyo, Japan

Junichi Murai