Fujikoki Corporation

Junichi Miyano

Keiji Sasaki

Akira Sawada

A pressure sensor comprises a housing having a pressure introduction hole , a sensor element having semiconductor elements with piezoresist effects, a holder for fixing the sensor element , and a pressure case having electromagnetic shield effect. The sensor element , holder and pressure case are welded airtightly so as to form a pressure sensor body formed with a reference pressure space. The pressure sensor body is retained in an electrically insulated manner in the housing

Noise reduced pressure sensor

The object of the present invention is to provide a pressure sensor comprising a pressure sensing element of a plurality of resistors on a semiconductor board, wherein said pressure sensing element is fixed inside the housing firmly and airtightly. A pressure sensor,comprising a housing,made of metal material, and a pressure sensing element mounted on a semiconductor board,positioned in the interior of said housing for sensing pressure, wherein said housing,comprises a liquid induction hole,, an inner area connecting to said liquid induction hole and having an opening in an upper portion, and an annular protrusion 11,formed in the peripheral of an opening of said liquid induction hole at a bottom portion of said inner area, characterized in that said pressure sensing element,is welded airtightly to said protrusion,of said housing,through a seat,comprising an opening,at the center thereof formed of a pressure sensing element mounting member,-,and a stem connecting member,, and a stem,having an opening,at the center thereof.

Semiconductor pressure sensor for sensing fluid pressure

The present pressure sensor is formed to enable an easy assembly of the sensor body, the sensor element, the substrate, the lead, the shield plate, the terminal holder, the terminal, the water-proof o-ring, the connector case, and further enabling an easy change in design of the connector case. In a pressure sensor comprising a housing 1 and a connector case 9, and having in the interior thereof a sensor element 2, a substrate 3, a lead 4, a shield plate 5, a terminal holder 71, a terminal 72, water-proof o-rings 8a and 8b, a joint 6 is equipped having a staking portion against the housing 1 and the connector case 9 on its upper portion and its lower portion. This could be formed as a joint having a shield portion formed as one unit.

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Tokyo, Japan

Junichi Miyano