Kao Corporation

Hitachi Metals, Ltd.

Junichi Masukawa

Nobuyuki Isshiki

Toshiharu Numata

Eiten Chin

Nobunori Ohji

Yutaka Uematsu

Koji Ichikawa

Hiroyuki Nagatomo

Hatsuo Ikeda

Provided is a circuit substrate for a semiconductor package used for mounting a plurality of semiconductor devices. The circuit substrate including: a first circuit substrate unit; and a second circuit substrate unit that is formed on the first circuit substrate unit, wherein Young's modulus of a first dielectric material composing the dielectric layer of the first circuit substrate unit is higher than Young's modulus of a second dielectric material composing the dielectric layer of the second circuit substrate unit, and a coefficient of thermal expansion of the first dielectric material composing the dielectric layer of the first circuit substrate unit is smaller than a coefficient of thermal expansion of the second dielectric material composing the dielectric layer of the second circuit substrate unit.

Circuit substrate for semiconductor package with multiple circuit substrate units and semiconductor package therefor

Disclosed is a dielectric ceramic composition which has high dielectric constant and suppressed low thermal expansion coefficient. Also disclosed are a multilayer dielectric substrate using the dielectric ceramic composition, and an electronic component. Specifically disclosed is a dielectric ceramic composition which contains an ATiO(wherein A represents either Ca and/or Sr) phase and an AAlSiOphase, said dielectric ceramic composition being characterized in that the dielectric constant is not less than 10 at 3 GHz and the average thermal expansion coefficient over the temperature range of 40-600&#xb0; C. is less than 7 ppm/&#xb0; C.

Dielectric ceramic composition, multilayer dielectric substrate, electronic component, and method for producing dielectric ceramic composition

A coating apparatus comprises an upstream lip and a downstream lip defining a slot between the two lips through which a coating liquid can be extruded; and a pair of guide rollers disposed on opposite side of the lips for guiding a support to move past the lips such that the coating liquid can be applied thereto, wherein the downstream lip has a coating operation surface facing and curved toward the support and, a curvature k of the curved coating operation surface being given as

Coating apparatus

Growing community of inventors

Tokyo, Japan

Junichi Masukawa