Asahi Kasei Emd Corporation

Kokusai Electric Co., Ltd.

Junichi Machida

Toshio Kaiho

Yasuhiro Inokuchi

Tetsuaki Inada

Fumihide Ikeda

Hisashi Nomura

Kazuhiro Shimeno

Masayuki Tomita

A driving device and driving method for controlling electric power to a load is provided. The driving device controls switching operations of switching elements by setting a first duration in which electric power is supplied to the load and by setting a second duration in which the load is floated without electric power. The driving device feeds back an output signal outputted from output terminals of the load, receives an input signal, and compares the fed back output signal with the input signal to detect an error. The driving device also generates an error suppression signal to correct the detected error and controls the switching operation of the switching elements based on the error suppression signal.

Driving device and driving method

Output signal waveform having high input signal reproducibility is outputted from inductive load or the like. Output signals Vand Vobtained by feeding back an output signal Vp-nat output terminalsandacross load Lto input terminalsandare compared with an input signal Vin to detect an error between signals; a first error suppression signal Voutis produced such that the detected error between the signals is suppressed; inclination of first error suppression signal Voutis detected, and a second error suppression signal Voutis produced such that inclination error to input signal Vin is suppressed based on the detected inclination signal; and the ratio between the period that electric power is supplied to the load Land the period that electric power is not supplied to the load Lis modified according to the error of the error suppression signal.

Driving device

A substrate processing apparatus includes a substrate supporting pedestal having an upper substrate supporting pedestal and a lower substrate supporting pedestal which are vertically stacked, an upper resistance heater provided above the upper substrate supporting pedestal so as to be opposite to the upper substrate supporting pedestal, and a lower resistance heater provided under the lower substrate supporting pedestal so as to be opposite to the lower substrate supporting pedestal. Each of the upper substrate supporting pedestal and the lower substrate supporting pedestal is capable of mounting a substrate or substrates in a substantially horizontal position, and the lower substrate supporting pedestal including an opening which exposes the substrate in its entirety or openings which expose the substrates in their entireties as viewed from under the lower substrate supporting pedestal.

Heat treatment of semiconductor wafers where upper heater directly heats

Growing community of inventors

Tokyo, Japan

Junichi Machida