Mitsubishi Shindoh Co., Ltd.

Junichi Kumagai

Takeshi Suzuki

Rensei Futatsuka

Shunichi Chiba

Masahiko Ishida

Manpei Kuwahara

Shin Kikuchi

Yoshiharu Mae

Katsuyoshi Narita

This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 &#x3bc;m, a second grain group including grains having a grain size of greater than 1.5 &#x3bc;m and less than 7 &#x3bc;m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 &#x3bc;m, and also the sum of &#x3b1; and &#x3b2; is greater than &#x3b3;, and &#x3b1; is less than &#x3b2;, where &#x3b1; is a total area ratio of the first grain group, &#x3b2; is a total area ratio of the second grain group, and &#x3b3; is a total area ratio of the third grain group, based on a unit area, and &#x3b1;+&#x3b2;+&#x3b3;=1.

Copper alloy and method of manufacturing the same

A high-strength Cu based alloy, consists of:

High-strength copper based alloy free from smutting during pretreatment

A copper based alloy consists essentially, by weight %, of 15 to 35% Zn, 7 to 14% Ni, 0.1 to 2% or less Mn, 0.01 to 0.5% Fe, 0.0005 to 0.1% P, at least one or two elements selected from the group consisting of 0.001 to 0.9% Si, 0.0003 to 0.02% Pb, and 0.0003 to 0.01% C, the total content of the selected at least two elements being limited to a range of 0.0006 to 0.9%, and the balance of Cu and inevitable impurities. The copper based alloy has excellent blankability as well as good corrosion resistance and high strength.

Corrosion-resistant high-strength copper based alloy having excellent

There is provided a lead frame material formed of a Cu alloy for a resin sealed type semiconductor device, wherein the Cu alloy consists essentially of 2 to 4% Ni, more than 0.5 to 1%, Si, 0.1 to 2% Zn, more than 0.01 to 0.05%, Mg, 0.05 to 1% Sn, and the balance of Cu and inevitable impurities, the inevitable impurities containing 20 ppm or less sulfur (S) and 20 ppm or less carbon (C). The lead frame material formed of the Cu alloy has improved adhesion strength to an epoxy resin as a sealing material. A semiconductor device prepared from said lead frame material is also provided.

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Aizuwakamatsu, Japan

Junichi Kumagai