Hitachi Chemical Company, Ltd.

Technopolis Hakodata Industrial Technology Promotion Organization

Technopolis Hakodate Industrial Technology

Junichi Kikuchi

Hideji Kuwajima

Hiroshi Wada

Shozo Yamana

Akihiro Sasaki

Keizo Hirai

Hisashi Kaga

Yoshikatsu Mikami

Kuniaki Sato

Hisashi Dokochi

Toshikazu Ono

A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper toil lands and copper foil circuits formed on surfaces of the substrate; insulating layers formed on the copper toil circuits and between necessary portions of the copper foil lands and the copper foil circuits; and printed circuits (jumper circuits) formed by another electroconductive material having a different composition from that filling the through-holes on a part of the copper foil circuits, and the copper foil lands and the insulating layers except for unnecessary portions for electroconductivity; wherein the printed circuits and ends of the through-holes are electrically connected with an electroconductive material having a different composition from that filling the through-holes, permits easy formation of an electrical connection of the through-holes, has a high reliability on connection and is suitable for industrial production.

Through-hole wiring board

Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.

Electric circuit device having circuit conductors using an

Composite electroconductive powder, electroconductive paste, process for

Electroconductive paste

Growing community of inventors

Hitachi, Japan

Junichi Kikuchi