Tokyo Ohka Kogyo Co., Ltd.

Junichi Katsuragawa

Akihiko Nakamura

Yoshihiro Inao

Satoshi Kobari

Shigeru Kato

Yasumasa Iwata

Atsushi Miyanari

Tamotsu Sasaki

Shugo Tsushima

An overlapping device which is configured to detect the center positions of a substrate and a support which are held in a center position detecting portion, carry the substrate and the support from the center position detecting portion to an overlapping portion, and overlap the substrate and the support such that the detected center positions of the substrate and the support are overlapped in the overlapping portion.

Overlapping device, and overlapping method

An attaching apparatus, a substrate and a support that can be uniformly attached through an adhesive layer. The attaching apparatus is equipped with a set plate and a press plate formed of ceramics. The set plate and the press plate have a flatness of 1.0 &#x3bc;m or less when not pressed.

Attaching apparatus

An attaching device configured to attach a substrate and a support via an adhesive layer is provided with support holding members. Holding tools of the support holding members are configured to hold the support with oblique surface parts (contact members) of the holding tools without coming into contact with a surface of the support, which is to be attached to the substrate. The attaching device attaches, to the substrate, the support of which the surface is held not to be contacted.

Attaching device and attaching method

A sucking and holding device includes: a vacuum chuck for vacuum-sucking a substrate; and a suction assisting device for sandwiching the object between it and the vacuum chuck. The suction assisting device includes a substrate-facing surface. The substrate-facing surface seals a through hole provided in the substrate. With this configuration, the sucking and holding device can vacuum-suck and hold the substrate having a through hole. This leads to an accomplishment of a device which can hold various objects without positional displacement.

Sucking and holding device

Provided is an alignment apparatus including holding and rotating means for holding an alignment object and rotating the alignment object, the alignment apparatus including supporting means for supporting that part of the alignment object being rotated which is different from that part of the alignment object which is held by the holding and rotating means. This makes it possible to align the alignment object highly accurately by preventing the alignment object from being deformed, e.g. bent, due to its own weight.

Alignment apparatus and alignment method

A separating device according to the present invention separates a support plate () from a substrate () of a laminate () including the substrate () and the support plate () bonded to each other. The separating device includes: a first storing section () for storing the laminate (); a plurality of first processing sections () for reducing adhesive force of an adhesive () applied between the substrate () and the support plate (); and a first carrying section () which is capable of moving in the first direction and carries the laminate () from the first storing section () to the first processing section () while holding the laminate (). With the first carrying section (), it is possible to provide a separating device () which moves straightly so as to carry the laminate (). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.

Separating device

A treatment liquid permeation unit comprises: at least one vibration unit; and a vibration transmission unit for transmitting a vibration from the vibration unit. The vibration transmission unit is positioned between an adhesive with which a wafer is combined to a supporting plate or an adhesive adhered to a surface of the wafer and the vibration unit. A vibration from the vibration unit is transmitted via the vibration transmission unit. This promotes the treatment liquid for dissolving the adhesive to permeate the adhesive to which the treatment liquid is supplied. Therefore, the treatment liquid can more uniformly permeate the adhesive in a shorter time. This allows the treatment liquid for dissolving the adhesive to permeate the adhesive with which the wafer is combined to the supporting plate or to permeate the adhesive adhered to the surface of the wafer in a shorter time.

Growing community of inventors

Kawasaki, Japan

Junichi Katsuragawa