Okuno Chemical Industries Co., Ltd.

Other

Panasonic Holdings Corporation

Junichi Katayama

Hisaya Takahashi

Hirofumi Nakamura

Kuniaki Otsuka

Kenji Hara

Masanobu Izaki

Shingo Nagamine

Shuhei Fuku

Mayu Tsukuda

Toshimitsu Nagao

Kazuya Shimada

Masahito Hayamizu

Toshihiko Sakata

Asuka Hirooka

Ryuichi Tamura

Takamitsu Tsujimoto

The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

Plating film and plating film production method

The present invention provides a blackening treatment method for a black Cr&#x2014;Co alloy plating film, the method comprising bringing a black Cr&#x2014;Co alloy plating film having a Cr content of 1 to 15 wt. % into contact with a blackening treatment solution comprising an aqueous solution with a pH value of &#x2212;1 to 5. According to the present invention, the blackish color of a less blackish plating film formed from a plating bath containing trivalent chromium is enhanced to further improve decorativeness. Furthermore, the corrosion resistance of the film can be more improved by performing electrolytic chromate treatment after blackening treatment.

Blackening treatment solution for black Cr&#x2014;Co alloy plating film

A method for forming a Cu interconnect pattern on a ZnO film of a printed circuit board without using a metallic catalyst on the ZnO film includes the steps of replacing Zn in the ZnO film by Cu in an aqueous solution of copper sulfate to form a CuO film, reducing the CuO in the CuO film to Cu in an aqueous solution of hydrogenated boron potassium to form a metallic Cu film, and plating the metallic Cu film with a plating Cu film in a plating liquid. The absence of the metallic catalyst improves the insulation resistance of the Cu interconnect pattern in the printed circuit board.

Method for forming a Cu interconnect pattern

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Osaka, Japan

Junichi Katayama