Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi-omron Terminal Solutions, Corporation

Junichi Katagiri

Takashi Sato

Akio Takahashi

Akira Nagai

Toshikazu Narahara

Katuo Sugawara

Masahiro Suzuki

Masahiro Ono

Motoyo Wajima

Masao Suzuki

Haruo Akahoshi

Akio Mukoh

Hitoshi Yokono

Yoshitaka Takezawa

Noriyuki Kinjo

Shin Nishimura

Akio Nishikawa

Masato Kobayashi

Kenji Tsuchiya

Ayumu Morita

Ryo Hiraga

Keiko Tawara

Tsuguo Kobayashi

Tamotsu Ikeda

Takao Miwa

Fumiyuki Kobayashi

Mineo Kawamoto

Tomoaki Utsumi

Ryuji Watanabe

Yuzo Ito

Toru Koyama

Tsutomu Imai

Makoto Yano

Mitsunari Kano

Shuichi Kikukawa

Junji Mukai

Osamu Miura

Masanori Nemoto

Toshiro Uemura

Eiji Mizuno

Yoshinori Kawai

Tadashi Narita

Tokio Hagiwara

Yoichi Daiko

Hiroshi Hamana

Akio Mukoo

Kouji Fujisaki

Hiroko Ohayashi

Mitsunari c/o Hitachi Systems&Services Ltd Kano

A vacuum switchgear has a vacuum valve including a movable conductor connected to an insulating rod, and a fixed conductor connected to a bus bar or to a load cable, a vacuum chamber encasing the vacuum valve, an insulating envelope covering the vacuum chamber, the outer surface thereof being covered with an electro-conductive layer thereby to earth the envelope, and an insulating lid gas-tightly fitted to the insulating envelope. The lid has an insulating bushing through which an insulating rod penetrates, the insulating rod being connected to an operating mechanism, wherein the insulating rod except a portion exposed from the bushing is gas-tightly confined in insulating gas atmosphere formed between the insulating envelope and the insulating lid.

Vacuum switchgear

A bill discriminating method of discriminating a paper material independent of a light/dense pattern caused by a difference of manufacturing steps and discriminating a paper material of paper without being influenced by humidity or deterioration of the paper material is provided, Two kinds of infrared rays of different kinds of wavelengths are irradiated onto the paper, thereby discriminating the paper material of the paper by using an absorbance difference between photometric values.

Method and apparatus for paper material discrimination with two near-infrared lights

A measurement method and apparatus, which are capable of simply measuring the water content of an object with a high degree of accuracy, is characterized by irradiating the surface of the object with at least two monochromatic light beams having different wave length values, one of the wave length values being less than 1350 nm; measuring the intensity of light for each of the light beams reflected from the surface of the object using a light intensity-measurement unit; obtaining the reflective absorbance (A ) of each light beam; calculating a reflective-absorbance differences (&Dgr;A ) between, or a reflective-absorbance ratio (A &prime;) of, the respective light beams, respectively; and estimating the water content of the measured object by using the relationship between water content and the reflective-absorbance differences or reflective-absorbance ratio, which relationship stored in a memory device in advance.

Water content-measurement method and water content-measurement apparatus, and electrical component-fabrication method using the measurement apparatus and method

A photosensitive resin composition for use in manufacture of multi-layer circuit boards with connecting holes between layers is disclosed. The resin composition has excellent adhesion with a plating metal, resolution, photo-curing, thermosetting, thermal resistance, and is capable of being developed using an alkaline solution or an aqueous solution containing a non-halogen based organic solvent as the developing solution. The resin composition comprises a photosensitive epoxy resin, a thermosetting epoxy resin, a reactant of a carboxylic acid added to an acrylonitrile-butadiene rubber and an epoxy resin, a photo-polymerization initiator and a thermosetting agent. This reactant facilitates a high density pattern of connecting holes for circuit boards of the layered type.

Photosensitive resin composition and method for using the same in

A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.

Method for producing thin film multilayer wiring board

A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

LSI package board

A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

Multilayer printed circuit board and production thereof

According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant. A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.

Fluorine-containing curable resin composition and use thereof

A flame-retardant resin composition contains a prepolymer represented by the general formula: ##STR1## wherein R.sub.1 stands for a hydrogen atom or an unreactive saturated group; R.sub.2 stands for a reactive unsaturated group; m and n each stand for a positive number of 1 to 4 and X and Y are each a copolymerization ratio and are in the range of 0.3 to 0.7 with the proviso that the sum total of X and Y is 1, as an essential component. The flame retardant resin composition is curable with uniform crosslinking density and without substantial stress concentration and is suitable for producing a laminate for a multilayer printed wiring board having a high thermal impact resistance as well as excellent heat resistance and

Flame-retardant resin composition containing a bromostyrene prepolymer

The present invention provide a thermosetting resin composition comprising

Thermosetting resin composition, and prepreg and laminated sheet which

The present invention provides a thermosetting resin composition comprising

Prepreg from poly(p-hydroxystyrene), epoxy-modified polybutadiene and

The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.

Multi-layer circuit board, method of manufacturing the same and

A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):

Thermosetting resin composition, printed circuit board using the resin

A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

Thermosetting resin and prepreg and laminate using the same

Composition comprising poly(p-hydroxystrene) derivative, epoxy-modified

Growing community of inventors

Ibaraki, Japan

Junichi Katagiri